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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
256-1292-00-0602JCONN IC DIP SOCKET ZIF 56POS GLD 3M |
3,668 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 56 (2 x 28) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
228-7396-55-1902CONN SOCKET SOIC 28POS GOLD 3M |
2,129 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SOIC | 28 (2 x 14) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
232-2601-00-0602CONN SOCKET SIP ZIF 32POS GOLD 3M |
3,913 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SIP, ZIF (ZIP) | 32 (1 x 32) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
240-5205-00CONN SOCKET QFN 40POS GOLD 3M |
2,877 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | QFN | 40 (4 x 10) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
216-5205-01CONN SOCKET QFN 16POS GOLD 3M |
3,165 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | QFN | 16 (3x3) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
248-4205-01CONN SOCKET QFN 48POS GOLD 3M |
2,386 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | QFN | 48 (4 x 12) | 0.016 (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
115-43-318-41-003000CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp. |
140 | - |
RFQ |
Ficha técnica |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
317-47-121-41-005000CONN SOCKET SIP 21POS GOLD Mill-Max Manufacturing Corp. |
514 | - |
RFQ |
Ficha técnica |
Tube | 317 | Active | SIP | 21 (1 x 21) | 0.070 (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
115-43-318-41-001000CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp. |
128 | - |
RFQ |
Ficha técnica |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
123-47-314-41-001000CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp. |
3,696 | - |
RFQ |
Ficha técnica |
Tube | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
210-93-624-41-001000CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp. |
700 | - |
RFQ |
Ficha técnica |
Tube | 210 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
115-43-320-41-003000CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp. |
2,579 | - |
RFQ |
Ficha técnica |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
214-99-624-01-670800CONN IC DIP SOCKET 24POS TINLEAD Mill-Max Manufacturing Corp. |
481 | - |
RFQ |
Ficha técnica |
Tube | 214 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
115-43-324-41-001000CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp. |
117 | - |
RFQ |
Ficha técnica |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
115-93-324-41-001000CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp. |
2,476 | - |
RFQ |
Ficha técnica |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
115-93-624-41-001000CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp. |
2,168 | - |
RFQ |
Ficha técnica |
Tube | 115 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
214-99-628-01-670800CONN IC DIP SOCKET 28POS TINLEAD Mill-Max Manufacturing Corp. |
2,695 | - |
RFQ |
Ficha técnica |
Tube | 214 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
614-43-314-31-012000CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp. |
260 | - |
RFQ |
Ficha técnica |
Tube | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-47-950-41-001000CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp. |
3,237 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
AR 28-HZL/07-TTCONN IC DIP SOCKET 28POS GOLD Assmann WSW Components |
3,405 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
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