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0Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
40-6574-10CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics |
3,101 | - |
RFQ |
Ficha técnica |
Tube | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
40-9513-10CONN IC DIP SOCKET 40POS GOLD Aries Electronics |
2,542 | - |
RFQ |
Ficha técnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.9 (22.86mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
1-2324271-8LEFT SEGMEN LGA4189-5 SOCKET-P5 TE Connectivity AMP Connectors |
2,459 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
|
1-2324271-7RIGHT SEGMEN LGA4189-5 SOCKET-P5 TE Connectivity AMP Connectors |
3,944 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
2-2129710-8CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors |
2,490 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic |
|
2-2822979-4CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors |
2,410 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA | 3647 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
260-4204-01CONN SOCKET QFN 60POS GOLD 3M |
3,863 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | QFN | 60 (4 x 15) | 0.016 (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.016 (0.40mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
NTE435P18SOCKET FOR 18 PIN DIP NTE Electronics, Inc |
722 | - |
RFQ |
Ficha técnica |
Bag | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | - | - | - | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | - |
|
NTE423SOCKET-MINI-DIP 8-PIN NTE Electronics, Inc |
836 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | - | - | - | - | Through Hole | - | Solder | - | - | - | - | - |
|
NTE435P20IC 20 PIN DUAL INLINE NTE Electronics, Inc |
245 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | - | - | - | - | Through Hole | - | Solder | 0.100 (2.54mm) | - | - | - | - |
|
NTE42928-PIN SOCKET NTE Electronics, Inc |
398 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | - | 28 (2 x 14) | - | - | - | - | Through Hole | Open Frame | Solder | - | - | - | - | - |
|
NTE409IC SOCKET 14 PIN DIP NTE Electronics, Inc |
202 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | - | 14 (2 x 7) | - | - | - | - | Through Hole | - | Solder | - | - | - | - | - |
|
NTE42824-PIN SOCKET NTE Electronics, Inc |
562 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | - | 24 (2 x 12) | - | - | - | - | Through Hole | - | Solder | - | - | - | - | - |
|
NTE435P6IC DUAL INLINE 6 PIN NTE Electronics, Inc |
3,296 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | - | - | - | - | - | - | Solder | 0.100 (2.54mm) | - | - | - | - |
|
NTE430SOCKET 40 PIN NTE Electronics, Inc |
643 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | - | 40 (2 x 20) | - | - | - | - | Through Hole | - | Solder | - | - | - | - | - |
|
NTE435K30SOCKET-30 PIN DIP .070 NTE Electronics, Inc |
192 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.4 (10.16mm) Row Spacing | - | - | - | - | - | Through Hole | - | Solder | 0.070 (1.78mm) | - | - | - | - |
|
NTE416SOCKET 16PIN DIP NTE Electronics, Inc |
440 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | - | - | - | - | - | Solder | 0.100 (2.54mm) | - | - | - | - |
|
NTE435K28SOCKET-28 PIN DIP .070 NTE Electronics, Inc |
989 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | - | - | - | - | Through Hole | - | Solder | 0.070 (1.78mm) | - | - | - | - |
|
NTE435P42SOCKET-42 PIN DIP NTE Electronics, Inc |
3,418 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | - | - | - | - | Through Hole | - | Solder | 0.100 (2.54mm) | - | - | - | - |
|
NTE421SOCKET-TO-66 PWR NTE Electronics, Inc |
3,824 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Transistor, TO-66 | - | - | - | - | - | Through Hole | - | Solder | - | - | - | - | - |
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