+86 075582561136
Subir BOM
Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
02-0518-11CONN SOCKET SIP 2POS GOLD Aries Electronics |
2,829 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
02-1518-11CONN IC DIP SOCKET 2POS GOLD Aries Electronics |
2,910 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
06-0513-10TCONN SOCKET SIP 6POS GOLD Aries Electronics |
3,553 | - |
RFQ |
Ficha técnica |
Bulk | 0513 | Active | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
01-0503-21CONN SOCKET SIP 1POS GOLD Aries Electronics |
2,913 | - |
RFQ |
Ficha técnica |
Bulk | 0503 | Active | SIP | 1 (1 x 1) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
01-0503-31CONN SOCKET SIP 1POS GOLD Aries Electronics |
3,908 | - |
RFQ |
Ficha técnica |
Bulk | 0503 | Active | SIP | 1 (1 x 1) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 30.0µin (0.76µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
03-0518-11HCONN SOCKET SIP 3POS GOLD Aries Electronics |
3,351 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
07-0518-10HCONN SOCKET SIP 7POS GOLD Aries Electronics |
2,775 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
01-0508-21CONN SOCKET SIP 1POS GOLD Aries Electronics |
3,821 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | SIP | 1 (1 x 1) | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
01-0508-31CONN SOCKET SIP 1POS GOLD Aries Electronics |
2,783 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | SIP | 1 (1 x 1) | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
03-0518-10TCONN SOCKET SIP 3POS GOLD Aries Electronics |
2,333 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
01-0517-90CCONN SOCKET SIP 1POS GOLD Aries Electronics |
2,962 | - |
RFQ |
Ficha técnica |
Bulk | 0517 | Active | SIP | 1 (1 x 1) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle | - | Solder | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
02-0513-10HCONN SOCKET SIP 2POS GOLD Aries Electronics |
2,301 | - |
RFQ |
Ficha técnica |
Bulk | 0513 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
04-0518-10CONN SOCKET SIP 4POS GOLD Aries Electronics |
2,142 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
04-1518-10CONN IC DIP SOCKET 4POS GOLD Aries Electronics |
3,806 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
03-0513-10TCONN SOCKET SIP 3POS GOLD Aries Electronics |
2,604 | - |
RFQ |
Ficha técnica |
Bulk | 0513 | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
03-0518-10HCONN SOCKET SIP 3POS GOLD Aries Electronics |
3,604 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
03-0513-10CONN SOCKET SIP 3POS GOLD Aries Electronics |
3,905 | - |
RFQ |
Ficha técnica |
Bulk | 0513 | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
03-0518-11CONN SOCKET SIP 3POS GOLD Aries Electronics |
3,783 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
04-0518-10TCONN SOCKET SIP 4POS GOLD Aries Electronics |
3,376 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
04-1518-10TCONN IC DIP SOCKET 4POS GOLD Aries Electronics |
3,239 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
