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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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20-0518-10TCONN SOCKET SIP 20POS GOLD Aries Electronics |
3,966 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
16-3518-11CONN IC DIP SOCKET 16POS GOLD Aries Electronics |
2,884 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
32-C182-10CONN IC DIP SOCKET 32POS GOLD Aries Electronics |
3,774 | - |
RFQ |
Ficha técnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
10-2822-90CONN IC DIP SOCKET 10POS GOLD Aries Electronics |
3,868 | - |
RFQ |
Ficha técnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
40-C212-10CONN IC DIP SOCKET 40POS GOLD Aries Electronics |
2,426 | - |
RFQ |
Ficha técnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
28-516-11CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics |
2,101 | - |
RFQ |
Ficha técnica |
Bulk | 516 | Active | DIP, ZIF (ZIP) | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
28-526-11CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics |
2,587 | - |
RFQ |
Ficha técnica |
Bulk | Lo-PRO®file, 526 | Active | DIP, ZIF (ZIP) | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
12-6810-90CCONN IC DIP SOCKET 12POS GOLD Aries Electronics |
2,240 | - |
RFQ |
Ficha técnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
40-516-11CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics |
3,255 | - |
RFQ |
Ficha técnica |
Bulk | 516 | Active | DIP, ZIF (ZIP) | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
108-PRS12005-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,971 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
44-547-11ECONN SOCKET SOIC ZIF 44POS GOLD Aries Electronics |
2,015 | - |
RFQ |
Ficha técnica |
Bulk | 547 | Active | SOIC, ZIF (ZIP) | 44 (2 x 22) | - | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
14-6511-10CONN IC DIP SOCKET 14POS TIN Aries Electronics |
3,801 | - |
RFQ |
Ficha técnica |
Bulk | 511 | Active | DIP, 0.6 (15.24mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
22-4518-11CONN IC DIP SOCKET 22POS GOLD Aries Electronics |
3,676 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
80-PGM15059-10CONN SOCKET PGA GOLD Aries Electronics |
3,613 | - |
RFQ |
Ficha técnica |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
28-6574-10CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics |
3,110 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
01-0513-10CONN SOCKET SIP 1POS GOLD Aries Electronics |
2,106 | - |
RFQ |
Ficha técnica |
Bulk | 0513 | Active | SIP | 1 (1 x 1) | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
01-0513-10TCONN SOCKET SIP 1POS GOLD Aries Electronics |
3,211 | - |
RFQ |
Ficha técnica |
Bulk | 0513 | Active | SIP | 1 (1 x 1) | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
01-0518-10CONN SOCKET SIP 1POS GOLD Aries Electronics |
3,739 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 1 (1 x 1) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
01-0518-10HCONN SOCKET SIP 1POS GOLD Aries Electronics |
3,059 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 1 (1 x 1) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
01-0518-10TCONN SOCKET SIP 1POS GOLD Aries Electronics |
3,150 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 1 (1 x 1) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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