Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
02-1508-30

02-1508-30

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics
2,116 -

RFQ

02-1508-30

Ficha técnica

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
14-3518-10T

14-3518-10T

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
2,140 -

RFQ

14-3518-10T

Ficha técnica

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0518-11

06-0518-11

CONN SOCKET SIP 6POS GOLD

Aries Electronics
2,987 -

RFQ

06-0518-11

Ficha técnica

Bulk 518 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-1518-11

06-1518-11

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
2,014 -

RFQ

06-1518-11

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0513-11

04-0513-11

CONN SOCKET SIP 4POS GOLD

Aries Electronics
2,774 -

RFQ

04-0513-11

Ficha técnica

Bulk 0513 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0513-10T

07-0513-10T

CONN SOCKET SIP 7POS GOLD

Aries Electronics
3,218 -

RFQ

07-0513-10T

Ficha técnica

Bulk 0513 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0518-10T

08-0518-10T

CONN SOCKET SIP 8POS GOLD

Aries Electronics
3,767 -

RFQ

08-0518-10T

Ficha técnica

Bulk 518 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-1518-10T

08-1518-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
3,182 -

RFQ

08-1518-10T

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
09-0518-10

09-0518-10

CONN SOCKET SIP 9POS GOLD

Aries Electronics
2,610 -

RFQ

09-0518-10

Ficha técnica

Bulk 518 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-3513-10

06-3513-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
3,426 -

RFQ

06-3513-10

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0518-10H

08-0518-10H

CONN SOCKET SIP 8POS GOLD

Aries Electronics
2,221 -

RFQ

08-0518-10H

Ficha técnica

Bulk 518 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-1518-10H

08-1518-10H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
2,896 -

RFQ

08-1518-10H

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-2513-10T

06-2513-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
3,349 -

RFQ

06-2513-10T

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0518-00

06-0518-00

CONN SOCKET SIP 6POS GOLD

Aries Electronics
3,156 -

RFQ

06-0518-00

Ficha técnica

Bulk 518 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-1518-00

06-1518-00

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
3,733 -

RFQ

06-1518-00

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0513-10H

05-0513-10H

CONN SOCKET SIP 5POS GOLD

Aries Electronics
3,171 -

RFQ

05-0513-10H

Ficha técnica

Bulk 0513 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0503-20

02-0503-20

CONN SOCKET SIP 2POS GOLD

Aries Electronics
2,990 -

RFQ

02-0503-20

Ficha técnica

Bulk 0503 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
02-0503-30

02-0503-30

CONN SOCKET SIP 2POS GOLD

Aries Electronics
3,439 -

RFQ

02-0503-30

Ficha técnica

Bulk 0503 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
09-0518-10T

09-0518-10T

CONN SOCKET SIP 9POS GOLD

Aries Electronics
2,223 -

RFQ

09-0518-10T

Ficha técnica

Bulk 518 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-1518-10

10-1518-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics
2,797 -

RFQ

10-1518-10

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 4324 Record«Prev1... 7891011121314...217Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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