Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
10-2810-90C

10-2810-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics
719 -

RFQ

10-2810-90C

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-2820-90C

10-2820-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics
142 -

RFQ

10-2820-90C

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-2810-90T

10-2810-90T

CONN IC DIP SOCKET 10POS TIN

Aries Electronics
460 -

RFQ

10-2810-90T

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
40-C182-10

40-C182-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
252 -

RFQ

40-C182-10

Ficha técnica

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-526-10

28-526-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics
1,360 -

RFQ

28-526-10

Ficha técnica

Bulk Lo-PRO®file, 526 Active DIP, ZIF (ZIP) 28 (2 x 14) 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
12-810-90C

12-810-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics
322 -

RFQ

12-810-90C

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
25-0503-30

25-0503-30

CONN SOCKET SIP 25POS GOLD

Aries Electronics
120 -

RFQ

25-0503-30

Ficha técnica

Bulk 0503 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
40-526-10

40-526-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics
3,267 -

RFQ

40-526-10

Ficha técnica

Bulk Lo-PRO®file, 526 Active DIP, ZIF (ZIP) 40 (2 x 20) 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
32-6554-10

32-6554-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics
706 -

RFQ

32-6554-10

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6554-10

40-6554-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics
360 -

RFQ

40-6554-10

Ficha técnica

Tube 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6554-11

24-6554-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics
183 -

RFQ

24-6554-11

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6554-10

48-6554-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics
320 -

RFQ

48-6554-10

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6554-11

28-6554-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics
342 -

RFQ

28-6554-11

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-6554-11

32-6554-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics
103 -

RFQ

32-6554-11

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6554-16

24-6554-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics
209 -

RFQ

24-6554-16

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
22-4518-10

22-4518-10

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
2,042 -

RFQ

22-4518-10

Ficha técnica

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6518-10

32-6518-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
889 -

RFQ

32-6518-10

Ficha técnica

Tube 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-10

24-4518-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,384 -

RFQ

24-4518-10

Ficha técnica

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8400-10

14-8400-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics
118 -

RFQ

14-8400-10

Ficha técnica

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-6513-10

18-6513-10

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
163 -

RFQ

18-6513-10

Ficha técnica

Tube Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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