Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-225-18-091101

510-83-225-18-091101

CONN SOCKET PGA 225POS GOLD

Preci-Dip
2,730 -

RFQ

510-83-225-18-091101

Ficha técnica

Bulk 510 Active PGA 225 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-225-15-000101

510-83-225-15-000101

CONN SOCKET PGA 225POS GOLD

Preci-Dip
3,806 -

RFQ

510-83-225-15-000101

Ficha técnica

Bulk 510 Active PGA 225 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-225-17-001101

510-83-225-17-001101

CONN SOCKET PGA 225POS GOLD

Preci-Dip
3,433 -

RFQ

510-83-225-17-001101

Ficha técnica

Bulk 510 Active PGA 225 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-225-17-061101

510-83-225-17-061101

CONN SOCKET PGA 225POS GOLD

Preci-Dip
3,747 -

RFQ

510-83-225-17-061101

Ficha técnica

Bulk 510 Active PGA 225 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-100-15-001101

550-80-100-15-001101

PGA SOLDER TAIL

Preci-Dip
2,435 -

RFQ

550-80-100-15-001101

Ficha técnica

Bulk 550 Active PGA 100 (15 x 15) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-100-13-062112

614-87-100-13-062112

CONN SOCKET PGA 100POS GOLD

Preci-Dip
2,210 -

RFQ

614-87-100-13-062112

Ficha técnica

Bulk 614 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-101-13-061112

614-87-101-13-061112

CONN SOCKET PGA 101POS GOLD

Preci-Dip
3,962 -

RFQ

614-87-101-13-061112

Ficha técnica

Bulk 614 Active PGA 101 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-256-16-000101

510-83-256-16-000101

CONN SOCKET PGA 256POS GOLD

Preci-Dip
3,891 -

RFQ

510-83-256-16-000101

Ficha técnica

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-233-18-071101

510-83-233-18-071101

CONN SOCKET PGA 233POS GOLD

Preci-Dip
2,293 -

RFQ

510-83-233-18-071101

Ficha técnica

Bulk 510 Active PGA 233 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-114-13-062101

550-80-114-13-062101

PGA SOLDER TAIL

Preci-Dip
3,580 -

RFQ

550-80-114-13-062101

Ficha técnica

Bulk 550 Active PGA 114 (13 x 13) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-232-17-061101

510-83-232-17-061101

CONN SOCKET PGA 232POS GOLD

Preci-Dip
2,374 -

RFQ

510-83-232-17-061101

Ficha técnica

Bulk 510 Active PGA 232 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-088-13-062112

614-83-088-13-062112

CONN SOCKET PGA 88POS GOLD

Preci-Dip
2,801 -

RFQ

614-83-088-13-062112

Ficha técnica

Bulk 614 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-088-13-081112

614-83-088-13-081112

CONN SOCKET PGA 88POS GOLD

Preci-Dip
2,882 -

RFQ

614-83-088-13-081112

Ficha técnica

Bulk 614 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-013101

116-87-652-41-013101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,007 -

RFQ

116-87-652-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-265-12-000111

517-87-265-12-000111

CONN SOCKET PGA 265POS GOLD

Preci-Dip
3,310 -

RFQ

517-87-265-12-000111

Ficha técnica

Bulk 517 Active PGA 265 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-133-14-002135

546-87-133-14-002135

CONN SOCKET PGA 133POS GOLD

Preci-Dip
2,155 -

RFQ

546-87-133-14-002135

Ficha técnica

Bulk 546 Active PGA 133 (14 x 14) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-133-14-002136

546-87-133-14-002136

CONN SOCKET PGA 133POS GOLD

Preci-Dip
3,246 -

RFQ

546-87-133-14-002136

Ficha técnica

Bulk 546 Active PGA 133 (14 x 14) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-640-10-002101

299-83-640-10-002101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,761 -

RFQ

299-83-640-10-002101

Ficha técnica

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-261-18-071101

510-83-261-18-071101

CONN SOCKET PGA 261POS GOLD

Preci-Dip
3,743 -

RFQ

510-83-261-18-071101

Ficha técnica

Bulk 510 Active PGA 261 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-361-19-000101

510-87-361-19-000101

CONN SOCKET PGA 361POS GOLD

Preci-Dip
3,737 -

RFQ

510-87-361-19-000101

Ficha técnica

Bulk 510 Active PGA 361 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 111112113114115116117118...142Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario