Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-236-17-061101

510-83-236-17-061101

CONN SOCKET PGA 236POS GOLD

Preci-Dip
2,737 -

RFQ

510-83-236-17-061101

Ficha técnica

Bulk 510 Active PGA 236 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-236-17-062101

510-83-236-17-062101

CONN SOCKET PGA 236POS GOLD

Preci-Dip
2,067 -

RFQ

510-83-236-17-062101

Ficha técnica

Bulk 510 Active PGA 236 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-084-10-031101

550-10-084-10-031101

PGA SOLDER TAIL

Preci-Dip
2,124 -

RFQ

550-10-084-10-031101

Ficha técnica

Bulk 550 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-237-17-061101

510-83-237-17-061101

CONN SOCKET PGA 237POS GOLD

Preci-Dip
2,521 -

RFQ

510-83-237-17-061101

Ficha técnica

Bulk 510 Active PGA 237 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-280-18-101111

517-87-280-18-101111

CONN SOCKET PGA 280POS GOLD

Preci-Dip
3,578 -

RFQ

517-87-280-18-101111

Ficha técnica

Bulk 517 Active PGA 280 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-127-16-091117

514-87-127-16-091117

CONN SOCKET PGA 127POS GOLD

Preci-Dip
2,847 -

RFQ

514-87-127-16-091117

Ficha técnica

Bulk 514 Active PGA 127 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-144-12-000117

514-87-144-12-000117

CONN SOCKET PGA 144POS GOLD

Preci-Dip
2,168 -

RFQ

514-87-144-12-000117

Ficha técnica

Bulk 514 Active PGA 144 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-241-18-072101

510-83-241-18-072101

CONN SOCKET PGA 241POS GOLD

Preci-Dip
3,177 -

RFQ

510-83-241-18-072101

Ficha técnica

Bulk 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-240-16-001101

510-83-240-16-001101

CONN SOCKET PGA 240POS GOLD

Preci-Dip
3,921 -

RFQ

510-83-240-16-001101

Ficha técnica

Bulk 510 Active PGA 240 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-241-18-071101

510-83-241-18-071101

CONN SOCKET PGA 241POS GOLD

Preci-Dip
3,846 -

RFQ

510-83-241-18-071101

Ficha técnica

Bulk 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-240-17-061101

510-83-240-17-061101

CONN SOCKET PGA 240POS GOLD

Preci-Dip
3,791 -

RFQ

510-83-240-17-061101

Ficha técnica

Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-084-13-081101

550-10-084-13-081101

PGA SOLDER TAIL

Preci-Dip
3,408 -

RFQ

550-10-084-13-081101

Ficha técnica

Bulk 550 Active PGA 84 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-121-13-061101

550-80-121-13-061101

PGA SOLDER TAIL

Preci-Dip
2,773 -

RFQ

550-80-121-13-061101

Ficha técnica

Bulk 550 Active PGA 121 (13 x 13) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-145-15-081117

514-87-145-15-081117

CONN SOCKET PGA 145POS GOLD

Preci-Dip
2,707 -

RFQ

514-87-145-15-081117

Ficha técnica

Bulk 514 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-144-13-041135

546-87-144-13-041135

CONN SOCKET PGA 144POS GOLD

Preci-Dip
2,834 -

RFQ

546-87-144-13-041135

Ficha técnica

Bulk 546 Active PGA 144 (13 x 13) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-144-13-041136

546-87-144-13-041136

CONN SOCKET PGA 144POS GOLD

Preci-Dip
3,283 -

RFQ

546-87-144-13-041136

Ficha técnica

Bulk 546 Active PGA 144 (13 x 13) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-257-19-081101

510-83-257-19-081101

CONN SOCKET PGA 257POS GOLD

Preci-Dip
2,502 -

RFQ

510-83-257-19-081101

Ficha técnica

Bulk 510 Active PGA 257 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-257-20-111101

510-83-257-20-111101

CONN SOCKET PGA 257POS GOLD

Preci-Dip
2,741 -

RFQ

510-83-257-20-111101

Ficha técnica

Bulk 510 Active PGA 257 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-293-18-101111

517-87-293-18-101111

CONN SOCKET PGA 293POS GOLD

Preci-Dip
2,690 -

RFQ

517-87-293-18-101111

Ficha técnica

Bulk 517 Active PGA 293 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-124-13-041101

550-80-124-13-041101

PGA SOLDER TAIL

Preci-Dip
3,671 -

RFQ

550-80-124-13-041101

Ficha técnica

Bulk 550 Active PGA 124 (13 x 13) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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