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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
235-3019-02-0602CONN ZIG-ZAG ZIF 35POS GOLD 3M |
3,530 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 35 (1 x 17, 1 x 18) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
|
244-5205-003M TEXTOOL OPEN-TOP SOCKETS FOR 3M |
2,802 | - |
RFQ |
Box | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
256-5205-013M TEXTOOL 256-5205-01 QFN .5 MM 3M |
2,578 | - |
RFQ |
Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
268-4204-003M TEXTOOL 268-4204-00 QFN.4 MM 3M |
2,484 | - |
RFQ |
Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
260-5204-01CONN SOCKET QFN 60POS GOLD 3M |
2,726 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | QFN | 60 (4 x 15) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
264-4205-003M TEXTOOL OPEN-TOP SOCKETS FOR 3M |
3,893 | - |
RFQ |
Box | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
200-6325-9UN-1900CONN SOCKET PGA ZIF 625POS GOLD 3M |
3,121 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Obsolete | PGA, ZIF (ZIP) | 625 (25 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) |
|
216-6278-00-3303CONN IC DIP SOCKET ZIF 16POS GLD 3M |
3,139 | - |
RFQ |
Ficha técnica |
Tube | OEM | Obsolete | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled |
|
|
220-4842-00-3303CONN IC DIP SOCKET ZIF 20POS GLD 3M |
2,100 | - |
RFQ |
Ficha técnica |
Bulk | OEM | Obsolete | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled |
|
|
240-4846-00-3303CONN IC DIP SOCKET ZIF 40POS GLD 3M |
3,085 | - |
RFQ |
Ficha técnica |
Bulk | OEM | Obsolete | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled |
|
|
2100-7243-00-1807CONN SOCKET PQFP 100POS TIN-LEAD 3M |
2,431 | - |
RFQ |
Ficha técnica |
Bulk | OEM | Obsolete | QFP | 100 (4 x 25) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
268-5401-00-1102JHCONN SOCKET CLCC 68POS GOLD 3M |
2,262 | - |
RFQ |
Ficha técnica |
Tray | OEM | Obsolete | CLCC | 68 (4 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
268-5401-11-1102JHCONN SOCKET CLCC 68POS GOLD 3M |
2,015 | - |
RFQ |
Ficha técnica |
Bulk | OEM | Obsolete | CLCC | 68 (4 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
268-5401-50-1102JHCONN SOCKET CLCC 68POS GOLD 3M |
3,289 | - |
RFQ |
Ficha técnica |
Bulk | OEM | Obsolete | CLCC | 68 (4 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
268-5401-52-1102JHCONN SOCKET CLCC 68POS GOLD 3M |
2,402 | - |
RFQ |
Ficha técnica |
Bulk | OEM | Obsolete | CLCC | 68 (4 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
232-1297-00-3303CONN IC DIP SOCKET ZIF 32POS GLD 3M |
3,849 | - |
RFQ |
Ficha técnica |
Tube | OEM | Obsolete | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled |
|
290-1294-00-3302JCONN IC DIP SOCKET ZIF 90POS GLD 3M |
3,981 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | DIP, ZIF (ZIP) | 90 (2 x 45) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
218-7223-55-1902CONN SOCKET SOIC 18POS GOLD 3M |
3,553 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SOIC | 18 (2 x 9) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
|
ICO-083-S8A-TCONN IC DIP SOCKET 8POS TIN 3M |
3,333 | - |
RFQ |
Ficha técnica |
Tube | ICO | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polyester, Glass Filled |
|
|
ICO-083-S8-TCONN IC DIP SOCKET 8POS TIN 3M |
2,962 | - |
RFQ |
Ficha técnica |
Tube | ICO | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polyester, Glass Filled |
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