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Zócalos para circuitos integrados, transistores

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
232-5205-01 CONN SOCKET QFN 32POS GOLD 3M	2,291	-	RFQ	Ficha técnica	Bulk	Textool™	Active	QFN	32 (4 x 8)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)
240-5205-01 CONN SOCKET QFN 40POS GOLD 3M	3,088	-	RFQ	Ficha técnica	Bulk	Textool™	Active	QFN	40 (4 x 10)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)
4832-6004-CP CONN IC DIP SOCKET 32POS TIN 3M	1,424	-	RFQ	Ficha técnica	Tube	4800	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled
8432-21A1-RK-TP CONN SOCKET PLCC 32POS TIN 3M	1,052	-	RFQ	Ficha técnica	Tube	8400	Active	PLCC	32 (2 x 7, 2 x 9)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
200-6313-9UN-1900 CONN SOCKET PGA ZIF 169POS GOLD 3M	119	-	RFQ	Ficha técnica	Bulk	Textool™	Obsolete	PGA, ZIF (ZIP)	169 (13 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES)
200-6315-9UN-1900 CONN SOCKET PGA ZIF 225POS GOLD 3M	3,413	-	RFQ	Ficha técnica	Bulk	Textool™	Obsolete	PGA, ZIF (ZIP)	225 (15 x 15)	0.100 (2.54mm)	-	-	-	-	-	-	0.100 (2.54mm)	-	-	-	Polyethersulfone (PES)
200-6319-9UN-1900 CONN SOCKET PGA ZIF 361POS GOLD 3M	125	-	RFQ	Ficha técnica	Bulk	Textool™	Obsolete	PGA, ZIF (ZIP)	361 (19 x 19)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES)
200-6321-9UN-1900 CONN SOCKET PGA ZIF 441POS GOLD 3M	3,519	-	RFQ	Ficha técnica	Bulk	Textool™	Obsolete	PGA, ZIF (ZIP)	441 (21 x 21)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES)
264-1300-00-0602J CONN IC DIP SOCKET ZIF 64POS GLD 3M	3,831	-	RFQ	Ficha técnica	Tube	Textool™	Active	DIP, ZIF (ZIP), 0.9 (22.86mm) Row Spacing	64 (2 x 32)	0.070 (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.070 (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
4824-6004-CP CONN IC DIP SOCKET 24POS TIN 3M	240	-	RFQ	Ficha técnica	Tube	4800	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled
4828-3004-CP CONN IC DIP SOCKET 28POS TIN 3M	481	-	RFQ	Ficha técnica	Tube	4800	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled
8420-11B1-RK-TP CONN SOCKET PLCC 20POS TIN 3M	706	-	RFQ	Ficha técnica	Tube	8400	Active	PLCC	20 (4 x 5)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
8428-21B1-RK-TP CONN SOCKET PLCC 28POS TIN 3M	638	-	RFQ	Ficha técnica	Tube	8400	Active	PLCC	28 (4 x 7)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
8444-21A1-RK-TP CONN SOCKET PLCC 44POS TIN 3M	831	-	RFQ	Ficha técnica	Tube	8400	Active	PLCC	44 (4 x 11)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
8452-21A1-RK-TP CONN SOCKET PLCC 52POS TIN 3M	581	-	RFQ	Ficha técnica	Tube	8400	Active	PLCC	52 (4 x 13)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
8468-21B1-RK-TP CONN SOCKET PLCC 68POS TIN 3M	926	-	RFQ	Ficha técnica	Tube	8400	Active	PLCC	68 (4 x 17)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
8484-21B1-RK-TP CONN SOCKET PLCC 84POS TIN 3M	107	-	RFQ	Ficha técnica	Tube	8400	Active	PLCC	84 (4 x 21)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
4820-3000-CP CONN IC DIP SOCKET 20POS TIN 3M	246	-	RFQ	Ficha técnica	Tube	4800	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled
218-3341-00-0602J CONN IC DIP SOCKET ZIF 18POS GLD 3M	3,167	-	RFQ	Ficha técnica	Tray	Textool™	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
222-3343-00-0602J CONN IC DIP SOCKET ZIF 22POS GLD 3M	3,739	-	RFQ	Ficha técnica	Tube	Textool™	Active	DIP, ZIF (ZIP), 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled