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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
232-2601-00-0602CONN SOCKET SIP ZIF 32POS GOLD 3M |
3,913 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SIP, ZIF (ZIP) | 32 (1 x 32) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
240-5205-00CONN SOCKET QFN 40POS GOLD 3M |
2,877 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | QFN | 40 (4 x 10) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
216-5205-01CONN SOCKET QFN 16POS GOLD 3M |
3,165 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | QFN | 16 (3x3) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
248-4205-01CONN SOCKET QFN 48POS GOLD 3M |
2,386 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | QFN | 48 (4 x 12) | 0.016 (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
260-4204-01CONN SOCKET QFN 60POS GOLD 3M |
3,863 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | QFN | 60 (4 x 15) | 0.016 (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.016 (0.40mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
200-6311-9UN-1900CONN SOCKET PGA ZIF 121POS GOLD 3M |
2,863 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Obsolete | PGA, ZIF (ZIP) | 121 (11 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) |
|
200-6317-9UN-1900CONN SOCKET PGA ZIF 289POS GOLD 3M |
3,844 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Obsolete | PGA, ZIF (ZIP) | 289 (17 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) |
|
235-3019-01-0602CONN ZIG-ZAG ZIF 35POS GOLD 3M |
2,262 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 35 (1 x 17, 1 x 18) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
240-1280-00-0602JCONN IC DIP SOCKET ZIF 40POS GLD 3M |
3,795 | - |
RFQ |
Ficha técnica |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
|
288-4205-01CONN SOCKET QFN 88POS GOLD 3M |
3,446 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | QFN | 88 (4 x 22) | 0.016 (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.016 (0.40mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
4840-6004-CPCONN IC DIP SOCKET 40POS TIN 3M |
2,691 | - |
RFQ |
Ficha técnica |
Tube | 4800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
214-7390-55-1902CONN SOCKET SOIC 14POS GOLD 3M |
3,941 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SOIC | 14 (2 x 7) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
216-7383-55-1902CONN SOCKET SOIC 16POS GOLD 3M |
3,884 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SOIC | 16 (2 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
|
280-5205-01CONN SOCKET QFN 80POS GOLD 3M |
2,668 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | QFN | 80 (4 x 20) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
232-1287-00-0602JCONN IC DIP SOCKET ZIF 32POS GLD 3M |
2,451 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
240-1288-00-0602JCONN IC DIP SOCKET ZIF 40POS GLD 3M |
2,222 | - |
RFQ |
Ficha técnica |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
242-1293-00-0602JCONN IC DIP SOCKET ZIF 42POS GLD 3M |
2,128 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
228-7474-55-1902CONN SOCKET SOIC 28POS GOLD 3M |
3,393 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SOIC | 28 (2 x 14) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
236-6225-00-0602CONN SOCKET SIP ZIF 36POS GOLD 3M |
2,583 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SIP, ZIF (ZIP) | 36 (1 x 36) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
251-5949-02-0602CONN ZIG-ZAG ZIF 51POS GOLD 3M |
2,734 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 51 (1 x 25, 1 x 26) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
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