Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
232-2601-00-0602

232-2601-00-0602

CONN SOCKET SIP ZIF 32POS GOLD

3M
3,913 -

RFQ

232-2601-00-0602

Ficha técnica

Bulk Textool™ Active SIP, ZIF (ZIP) 32 (1 x 32) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
240-5205-00

240-5205-00

CONN SOCKET QFN 40POS GOLD

3M
2,877 -

RFQ

240-5205-00

Ficha técnica

Bulk Textool™ Active QFN 40 (4 x 10) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES)
216-5205-01

216-5205-01

CONN SOCKET QFN 16POS GOLD

3M
3,165 -

RFQ

216-5205-01

Ficha técnica

Bulk Textool™ Active QFN 16 (3x3) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole - Solder - Gold - Beryllium Copper Polyethersulfone (PES)
248-4205-01

248-4205-01

CONN SOCKET QFN 48POS GOLD

3M
2,386 -

RFQ

248-4205-01

Ficha técnica

Bulk Textool™ Active QFN 48 (4 x 12) 0.016 (0.40mm) Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES)
260-4204-01

260-4204-01

CONN SOCKET QFN 60POS GOLD

3M
3,863 -

RFQ

260-4204-01

Ficha técnica

Bulk Textool™ Active QFN 60 (4 x 15) 0.016 (0.40mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.016 (0.40mm) Gold - Beryllium Copper Polyethersulfone (PES)
200-6311-9UN-1900

200-6311-9UN-1900

CONN SOCKET PGA ZIF 121POS GOLD

3M
2,863 -

RFQ

200-6311-9UN-1900

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 121 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
200-6317-9UN-1900

200-6317-9UN-1900

CONN SOCKET PGA ZIF 289POS GOLD

3M
3,844 -

RFQ

200-6317-9UN-1900

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 289 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
235-3019-01-0602

235-3019-01-0602

CONN ZIG-ZAG ZIF 35POS GOLD

3M
2,262 -

RFQ

235-3019-01-0602

Ficha técnica

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
240-1280-00-0602J

240-1280-00-0602J

CONN IC DIP SOCKET ZIF 40POS GLD

3M
3,795 -

RFQ

240-1280-00-0602J

Ficha técnica

Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
288-4205-01

288-4205-01

CONN SOCKET QFN 88POS GOLD

3M
3,446 -

RFQ

288-4205-01

Ficha técnica

Bulk Textool™ Active QFN 88 (4 x 22) 0.016 (0.40mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.016 (0.40mm) Gold - Beryllium Copper Polyethersulfone (PES)
4840-6004-CP

4840-6004-CP

CONN IC DIP SOCKET 40POS TIN

3M
2,691 -

RFQ

4840-6004-CP

Ficha técnica

Tube 4800 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
214-7390-55-1902

214-7390-55-1902

CONN SOCKET SOIC 14POS GOLD

3M
3,941 -

RFQ

214-7390-55-1902

Ficha técnica

Bulk Textool™ Active SOIC 14 (2 x 7) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
216-7383-55-1902

216-7383-55-1902

CONN SOCKET SOIC 16POS GOLD

3M
3,884 -

RFQ

216-7383-55-1902

Ficha técnica

Bulk Textool™ Active SOIC 16 (2 x 8) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
280-5205-01

280-5205-01

CONN SOCKET QFN 80POS GOLD

3M
2,668 -

RFQ

280-5205-01

Ficha técnica

Bulk Textool™ Active QFN 80 (4 x 20) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.020 (0.50mm) Gold - Beryllium Copper Polyethersulfone (PES)
232-1287-00-0602J

232-1287-00-0602J

CONN IC DIP SOCKET ZIF 32POS GLD

3M
2,451 -

RFQ

232-1287-00-0602J

Ficha técnica

Bulk Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
240-1288-00-0602J

240-1288-00-0602J

CONN IC DIP SOCKET ZIF 40POS GLD

3M
2,222 -

RFQ

240-1288-00-0602J

Ficha técnica

Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
242-1293-00-0602J

242-1293-00-0602J

CONN IC DIP SOCKET ZIF 42POS GLD

3M
2,128 -

RFQ

242-1293-00-0602J

Ficha técnica

Bulk Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
228-7474-55-1902

228-7474-55-1902

CONN SOCKET SOIC 28POS GOLD

3M
3,393 -

RFQ

228-7474-55-1902

Ficha técnica

Bulk Textool™ Active SOIC 28 (2 x 14) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
236-6225-00-0602

236-6225-00-0602

CONN SOCKET SIP ZIF 36POS GOLD

3M
2,583 -

RFQ

236-6225-00-0602

Ficha técnica

Bulk Textool™ Active SIP, ZIF (ZIP) 36 (1 x 36) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
251-5949-02-0602

251-5949-02-0602

CONN ZIG-ZAG ZIF 51POS GOLD

3M
2,734 -

RFQ

251-5949-02-0602

Ficha técnica

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 51 (1 x 25, 1 x 26) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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