Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
276-6321-9UA-1902

276-6321-9UA-1902

TEST BURN-IN PGA

3M
2,775 -

RFQ

276-6321-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 76 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
2124-6313-9UA-1902

2124-6313-9UA-1902

TEST BURN-IN PGA

3M
3,950 -

RFQ

2124-6313-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 124 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
2209-6317-9UA-1902

2209-6317-9UA-1902

GRID ZIP

3M
3,425 -

RFQ

2209-6317-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 209 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
242A-6321-9UA-1902

242A-6321-9UA-1902

TEXTOOL PGA SKT

3M
3,277 -

RFQ

242A-6321-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 441 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
2225-6317-9UA-1902

2225-6317-9UA-1902

TEXTOOL

3M
2,109 -

RFQ

2225-6317-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 225 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
2120-6313-9UA-1902

2120-6313-9UA-1902

PGA 13 X13

3M
2,714 -

RFQ

2120-6313-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 120 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
2361-6319-9UA-1902

2361-6319-9UA-1902

GRID ZIP 19 X 19

3M
3,242 -

RFQ

2361-6319-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 361 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
2144-6315-9UA-1902

2144-6315-9UA-1902

GRID ZIP 15 X 15

3M
2,067 -

RFQ

2144-6315-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 144 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
2299-6321-9UA-1902

2299-6321-9UA-1902

GRID ZIP 21 X 21

3M
2,610 -

RFQ

2299-6321-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 299 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
244A-6313-9UA-1902

244A-6313-9UA-1902

TEXTOOL

3M
2,848 -

RFQ

244A-6313-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 169 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
2108-6313-9UA-1902

2108-6313-9UA-1902

GRID ZIP 13 X 13

3M
2,411 -

RFQ

2108-6313-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 108 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
284-6311-9UA-1902

284-6311-9UA-1902

GRID ZIP 11 X 11

3M
3,512 -

RFQ

284-6311-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 84 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
224A-6313-9UA-1902

224A-6313-9UA-1902

TEXTOOL 13 X 13 PGA

3M
2,327 -

RFQ

224A-6313-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 169 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
2289-6317-9UA-1902

2289-6317-9UA-1902

GRID ZIP 17 X 17

3M
3,098 -

RFQ

2289-6317-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 289 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
2225-6315-9UA-1902

2225-6315-9UA-1902

GRID ZIP 15X15

3M
2,511 -

RFQ

2225-6315-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 225 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
272-6311-9UA-1902

272-6311-9UA-1902

TEST BURN-IN PGA

3M
3,262 -

RFQ

272-6311-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 72 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
2180-6315-9UA-1902

2180-6315-9UA-1902

GRID ZIP 15 X 15

3M
2,774 -

RFQ

2180-6315-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 180 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
2169-6317-9UA-1902

2169-6317-9UA-1902

PGA

3M
2,085 -

RFQ

2169-6317-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 169 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
272-6325-9UA-1902

272-6325-9UA-1902

TEST BURN-IN PGA

3M
2,103 -

RFQ

272-6325-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 72 (25 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
2184-6325-9UA-1902

2184-6325-9UA-1902

TEST BURN-IN PGA

3M
2,259 -

RFQ

2184-6325-9UA-1902

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 184 (25 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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