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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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100-018-050CONN IC DIP SOCKET 18POS GOLD 3M |
3,381 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-018-051CONN IC DIP SOCKET 18POS GOLD 3M |
3,557 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-020-050CONN IC DIP SOCKET 20POS GOLD 3M |
3,642 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-020-051CONN IC DIP SOCKET 20POS GOLD 3M |
3,538 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-022-050CONN IC DIP SOCKET 22POS GOLD 3M |
2,763 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-024-051CONN IC DIP SOCKET 24POS GOLD 3M |
3,201 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-028-050CONN IC DIP SOCKET 28POS GOLD 3M |
3,718 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-028-051CONN IC DIP SOCKET 28POS GOLD 3M |
2,985 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-032-050CONN IC DIP SOCKET 32POS GOLD 3M |
3,772 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-032-051CONN IC DIP SOCKET 32POS GOLD 3M |
3,906 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-040-050CONN IC DIP SOCKET 40POS GOLD 3M |
2,211 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-040-051CONN IC DIP SOCKET 40POS GOLD 3M |
3,341 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-042-050CONN IC DIP SOCKET 42POS GOLD 3M |
2,068 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-048-050CONN IC DIP SOCKET 48POS GOLD 3M |
2,320 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
110-024-050CONN IC DIP SOCKET 24POS GOLD 3M |
3,393 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
130-024-050CONN IC DIP SOCKET 24POS GOLD 3M |
2,008 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
130-028-050CONN IC DIP SOCKET 28POS GOLD 3M |
3,862 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
300-032-050CONN SOCKET SIP 32POS GOLD 3M |
3,284 | - |
RFQ |
Box | 300 | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Closed Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | |
|
|
400-028-050CONN IC DIP SOCKET 28POS GOLD 3M |
2,832 | - |
RFQ |
Ficha técnica |
Box | 400 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - |
|
|
400-032-050CONN IC DIP SOCKET 32POS GOLD 3M |
2,311 | - |
RFQ |
Ficha técnica |
Box | 400 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - |
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