Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
400-040-050

400-040-050

CONN IC DIP SOCKET 40POS GOLD

3M
3,057 -

RFQ

400-040-050

Ficha técnica

Box 400 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100 (2.54mm) Gold 8.00µin (0.203µm) - -
500-032-050

500-032-050

CONN SOCKET SIP 32POS GOLD

3M
2,352 -

RFQ

500-032-050

Ficha técnica

Box - Obsolete SIP 32 (1 x 32) 0.100 (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100 (2.54mm) Gold 8.00µin (0.203µm) - -
2100-6310-9UA-1902

2100-6310-9UA-1902

10X10 GRID ZIP SOCKET

3M
2,590 -

RFQ

Bulk - Obsolete - 100 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
249-930X-XX-2401

249-930X-XX-2401

CONN SOCKET BGA 49POS GOLD

3M
2,532 -

RFQ

- Textool™ Obsolete BGA 49 (Verification Required) 0.039 (1.00mm) Gold - - Through Hole Closed Frame - - - - - -
4842-6004-CP

4842-6004-CP

CONN IC DIP SOCKET 42POS TIN

3M
2,405 -

RFQ

Bulk 4800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 135.0µin (3.43µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 135.0µin (3.43µm) Phosphor Bronze Polyester, Glass Filled
232-1270-01-0602

232-1270-01-0602

CONN SOCKET PGA ZIF 32POS GOLD

3M
3,459 -

RFQ

232-1270-01-0602

Ficha técnica

Bulk Textool™ Active PGA, ZIF (ZIP) 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
232-1270-02-0602

232-1270-02-0602

CONN SOCKET PGA ZIF 32POS GOLD

3M
3,986 -

RFQ

232-1270-02-0602

Ficha técnica

Bulk Textool™ Active PGA, ZIF (ZIP) 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
239-5605-02-0602

239-5605-02-0602

CONN ZIG-ZAG 39POS GOLD

3M
3,552 -

RFQ

239-5605-02-0602

Ficha técnica

Bulk - Active Zig-Zag 39 (1 x 19, 1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
CUSTOM BGA

CUSTOM BGA

CONN SOCKET BGA CUSTOM

3M
3,033 -

RFQ

CUSTOM BGA

Ficha técnica

- Textool™ Active BGA Custom 0.026 ~ 0.050 (0.65mm ~ 1.27mm) Custom Custom - Through Hole Custom - - - - - -
232-1270-51-0602

232-1270-51-0602

STAGGERED ZIP STRIP POCKETS 32 C

3M
2,597 -

RFQ

- Textool™ Active - - - - - - - - - - - - - -
232-1270-52-0602

232-1270-52-0602

STAGGERED ZIP STRIP POCKETS 32 C

3M
2,012 -

RFQ

- Textool™ Active - - - - - - - - - - - - - -
232-1271-00-1102JH

232-1271-00-1102JH

OEM LCC SOCKETS 32 POS SOLID LID

3M
2,267 -

RFQ

232-1271-00-1102JH

Ficha técnica

- OEM Obsolete - - - - - - - - - - - - - -
234-3034-51-0602

234-3034-51-0602

CONN ZIG-ZAG ZIF 34POS GOLD

3M
3,300 -

RFQ

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 34 (2 x 17) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
234-3034-52-0602

234-3034-52-0602

CONN ZIG-ZAG ZIF 34POS GOLD

3M
3,697 -

RFQ

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 34 (2 x 17) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
235-3019-51-0602

235-3019-51-0602

CONN ZIG-ZAG ZIF 35POS GOLD

3M
2,586 -

RFQ

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
235-3019-52-0602

235-3019-52-0602

CONN ZIG-ZAG ZIF 35POS GOLD

3M
3,841 -

RFQ

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
236-6225-50-0602

236-6225-50-0602

SOCKET ZIP IN-LINE 36POS

3M
3,445 -

RFQ

Box - Active - - - - - - - - - - - - - -
239-5605-51-0602

239-5605-51-0602

CONN SOCKET 39POS ZIP STRIP

3M
3,702 -

RFQ

- - Active - - - - - - - - - - - - - -
239-5605-52-0602

239-5605-52-0602

CONN SOCKET 39POS ZIP STRIP

3M
2,175 -

RFQ

- - Active - - - - - - - - - - - - - -
251-5949-51-0602

251-5949-51-0602

CONN ZIG-ZAG ZIF 51POS GOLD

3M
3,771 -

RFQ

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 51 (1 x 25, 1 x 26) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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