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0Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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DIP328-014BLFCONN IC DIP SOCKET 28POS TIN Amphenol ICC (FCI) |
2,697 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
DIP324-014BLFCONN IC DIP SOCKET 24POS TIN Amphenol ICC (FCI) |
3,308 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
DIP328-011BLFCONN IC DIP SOCKET 28POS GOLD Amphenol ICC (FCI) |
2,449 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
DIP318-011BLFCONN IC DIP SOCKET 18POS GOLD Amphenol ICC (FCI) |
2,323 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
DIP316-011BLFCONN IC DIP SOCKET 16POS GOLD Amphenol ICC (FCI) |
2,266 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
DIP324-011BLFCONN IC DIP SOCKET 24POS GOLD Amphenol ICC (FCI) |
2,363 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP1X20-001BLFCONN SOCKET SIP 20POS GOLD Amphenol ICC (FCI) |
3,016 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
DIP314-001BLFCONN IC DIP SOCKET 14POS GOLD Amphenol ICC (FCI) |
3,989 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
DIP324-001BLFCONN IC DIP SOCKET 24POS GOLD Amphenol ICC (FCI) |
2,900 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
DIP316-001BLFCONN IC DIP SOCKET 16POS GOLD Amphenol ICC (FCI) |
2,530 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
DIP316-014BLFCONN IC DIP SOCKET 16POS TIN Amphenol ICC (FCI) |
3,950 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP050-1X04-157BLFCONN SOCKET SIP 4POS TIN Amphenol ICC (FCI) |
2,162 | - |
RFQ |
Ficha técnica |
Bulk | SIP050-1x | Obsolete | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP050-1X27-157BLFCONN SOCKET SIP 27POS TIN Amphenol ICC (FCI) |
2,959 | - |
RFQ |
Ficha técnica |
Bulk | SIP050-1x | Obsolete | SIP | 27 (1 x 27) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP1X20-041BLFCONN SOCKET SIP 20POS GOLD Amphenol ICC (FCI) |
2,309 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
DIP628-014BLFCONN IC DIP SOCKET 28POS TIN Amphenol ICC (FCI) |
2,670 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP050-1X18-157BLFCONN SOCKET SIP 18POS TIN Amphenol ICC (FCI) |
2,421 | - |
RFQ |
Ficha técnica |
Bulk | SIP050-1x | Obsolete | SIP | 18 (1 x 18) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
DIP306-001BLFCONN IC DIP SOCKET 6POS GOLD Amphenol ICC (FCI) |
2,096 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP050-1X02-157BLFCONN SOCKET SIP 2POS TIN Amphenol ICC (FCI) |
3,218 | - |
RFQ |
Ficha técnica |
Bulk | SIP050-1x | Obsolete | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SPF080-1X04-998ZCONN SOCKET SIP 4POS TIN-LEAD Amphenol ICC (FCI) |
3,800 | - |
RFQ |
Ficha técnica |
- | SPF080-1x | Obsolete | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Through Hole | Closed Frame | - | - | - | - | - | - |
|
|
SIP050-1X04-160BLFCONN SOCKET SIP 4POS GOLD Amphenol ICC (FCI) |
3,348 | - |
RFQ |
Ficha técnica |
Bulk | SIP050-1x | Obsolete | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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