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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SIP1X06-014BLFCONN SOCKET SIP 6POS TIN Amphenol ICC (FCI) |
2,152 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X05-014BLFCONN SOCKET SIP 5POS TIN Amphenol ICC (FCI) |
2,853 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X08-011BLFCONN SOCKET SIP 8POS GOLD Amphenol ICC (FCI) |
3,812 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X07-014BLFCONN SOCKET SIP 7POS TIN Amphenol ICC (FCI) |
2,500 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X06-011BLFCONN SOCKET SIP 6POS GOLD Amphenol ICC (FCI) |
3,065 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X07-011BLFCONN SOCKET SIP 7POS GOLD Amphenol ICC (FCI) |
3,824 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X05-011BLFCONN SOCKET SIP 5POS GOLD Amphenol ICC (FCI) |
3,927 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X08-001BLFCONN SOCKET SIP 8POS GOLD Amphenol ICC (FCI) |
2,162 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X06-001BLFCONN SOCKET SIP 6POS GOLD Amphenol ICC (FCI) |
3,030 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X09-001BLFCONN SOCKET SIP 9POS GOLD Amphenol ICC (FCI) |
2,663 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X04-011BLFCONN SOCKET SIP 4POS GOLD Amphenol ICC (FCI) |
2,226 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X04-014BLFCONN SOCKET SIP 4POS TIN Amphenol ICC (FCI) |
3,141 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X27-014BLFCONN SOCKET SIP 27POS TIN Amphenol ICC (FCI) |
3,026 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 27 (1 x 27) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X32-014BLFCONN SOCKET SIP 32POS TIN Amphenol ICC (FCI) |
3,707 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X16-014BLFCONN SOCKET SIP 16POS TIN Amphenol ICC (FCI) |
3,458 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X03-011BLFCONN SOCKET SIP 3POS GOLD Amphenol ICC (FCI) |
2,168 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X14-011BLFCONN SOCKET SIP 14POS GOLD Amphenol ICC (FCI) |
2,468 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP1X32-011BLFCONN SOCKET SIP 32POS GOLD Amphenol ICC (FCI) |
3,835 | - |
RFQ |
Ficha técnica |
Bulk | SIP1x | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
DIP640-011BLFCONN IC DIP SOCKET 40POS GOLD Amphenol ICC (FCI) |
3,773 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
DIP624-011BLFCONN IC DIP SOCKET 24POS GOLD Amphenol ICC (FCI) |
3,357 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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