Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
SIP050-1X30-157BLF

SIP050-1X30-157BLF

CONN SOCKET SIP 30POS TIN

Amphenol ICC (FCI)
2,535 -

RFQ

SIP050-1X30-157BLF

Ficha técnica

Bulk SIP050-1x Obsolete SIP 30 (1 x 30) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X26-160BLF

SIP050-1X26-160BLF

CONN SOCKET SIP 26POS GOLD

Amphenol ICC (FCI)
3,722 -

RFQ

SIP050-1X26-160BLF

Ficha técnica

Bulk SIP050-1x Obsolete SIP 26 (1 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X21-160BLF

SIP050-1X21-160BLF

CONN SOCKET SIP 21POS GOLD

Amphenol ICC (FCI)
3,006 -

RFQ

SIP050-1X21-160BLF

Ficha técnica

Bulk SIP050-1x Obsolete SIP 21 (1 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X31-157BLF

SIP050-1X31-157BLF

CONN SOCKET SIP 31POS TIN

Amphenol ICC (FCI)
3,865 -

RFQ

SIP050-1X31-157BLF

Ficha técnica

Bulk SIP050-1x Obsolete SIP 31 (1 x 31) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X27-160BLF

SIP050-1X27-160BLF

CONN SOCKET SIP 27POS GOLD

Amphenol ICC (FCI)
2,306 -

RFQ

SIP050-1X27-160BLF

Ficha técnica

Bulk SIP050-1x Obsolete SIP 27 (1 x 27) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP1X16-041BLF

SIP1X16-041BLF

CONN SOCKET SIP 16POS GOLD

Amphenol ICC (FCI)
3,937 -

RFQ

SIP1X16-041BLF

Ficha técnica

Bulk SIP1x Obsolete SIP 16 (1 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
DPF316-998Z

DPF316-998Z

CONN IC DIP SOCKET 16POS TINLEAD

Amphenol ICC (FCI)
2,766 -

RFQ

DPF316-998Z

Ficha técnica

Bag DPF3 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DPF314-998Z

DPF314-998Z

CONN IC DIP SOCKET 14POS TINLEAD

Amphenol ICC (FCI)
2,020 -

RFQ

DPF314-998Z

Ficha técnica

Bag DPF3 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DPF308-998Z

DPF308-998Z

CONN IC DIP SOCKET 8POS TIN-LEAD

Amphenol ICC (FCI)
3,799 -

RFQ

DPF308-998Z

Ficha técnica

Bag DPF3 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP1X02-041BLF

SIP1X02-041BLF

CONN SOCKET SIP 2POS GOLD

Amphenol ICC (FCI)
2,938 -

RFQ

SIP1X02-041BLF

Ficha técnica

Bulk SIP1x Obsolete SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
69802-128LF

69802-128LF

CONN SOCKET PLCC 28POS TIN

Amphenol ICC (FCI)
2,085 -

RFQ

69802-128LF

Ficha técnica

Tube - Obsolete PLCC 28 (4 x 7) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS)
69802-120LF

69802-120LF

CONN SOCKET PLCC 20POS TIN

Amphenol ICC (FCI)
2,996 -

RFQ

69802-120LF

Ficha técnica

Tube - Obsolete PLCC 20 (4 x 5) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS)
69802-168LF

69802-168LF

CONN SOCKET PLCC 68POS TIN

Amphenol ICC (FCI)
2,725 -

RFQ

69802-168LF

Ficha técnica

Tube - Obsolete PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS)
69802-452LF

69802-452LF

CONN SOCKET PLCC 52POS TIN

Amphenol ICC (FCI)
3,354 -

RFQ

69802-452LF

Ficha técnica

Tube - Obsolete PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS)
54020-68030LF

54020-68030LF

CONN SOCKET PLCC 68POS TIN

Amphenol ICC (FCI)
2,377 -

RFQ

54020-68030LF

Ficha técnica

Tube - Obsolete PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS)
54020-52030LF

54020-52030LF

CONN SOCKET PLCC 52POS TIN

Amphenol ICC (FCI)
2,822 -

RFQ

54020-52030LF

Ficha técnica

Tube - Obsolete PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS)
54020-84030LF

54020-84030LF

CONN SOCKET PLCC 84POS TIN

Amphenol ICC (FCI)
2,978 -

RFQ

54020-84030LF

Ficha técnica

Tube - Obsolete PLCC 84 (4 x 21) 0.050 (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS)
SIP41430-001LF

SIP41430-001LF

CONN SOCKET SIP 2POS TIN

Amphenol ICC (FCI)
3,418 -

RFQ

SIP41430-001LF

Ficha técnica

Tape & Reel (TR) - Obsolete SIP 2 (1 x 2) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyamide (PA), Nylon
69802-468PT

69802-468PT

CONN PRESS FIT 1X10

Amphenol ICC (FCI)
3,483 -

RFQ

Tape & Reel (TR) * Obsolete - - - - - - - - - - - - - -
Total 159 Record«Prev1... 45678Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario