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Microcontroladores integrados, módulos FPGA con microprocesador

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	RoHS	Speed	RAM Size	Flash Size	Part Status	Co-Processor	Connector Type	Core Processor	Size / Dimension	Module/Board Type	Operating Temperature
101-1055 IC MOD RABBIT 3000 44.2MHZ 1MB Digi	3,773	-	RFQ		Box	RabbitCore®	RoHS	44.2MHz	1MB	512KB (Internal), 32MB (External)	Obsolete	-	2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card	Rabbit 3000	1.85" x 2.73" (47mm x 69mm)	MPU Core	0°C ~ 70°C
TE0803-03-5DI21-A MODULE SOM TE0803-03 Trenz Electronic GmbH	2,117	-	RFQ		Bulk		RoHS	-	-	-	Obsolete	-	-	-	-	-	-
SOMOMAP3530-11-1670EFCR IC MOD CORTEX-A8 600MHZ 128MB Beacon EmbeddedWorks	3,268	-	RFQ	Ficha técnica	Bulk	OMAP35x	RoHS	600MHz	128MB	256MB	Obsolete	TMS320C64x (DSP)	Board-to-Board (BTB) Socket - 240	ARM® Cortex®-A8, OMAP3530	1.23" x 3.01" (31.2mm x 76.5mm)	MPU, DSP Core	0°C ~ 70°C
DXLH5290I IC MOD CORTEX-A9 1GHZ 2GB 512MB Dave Embedded Systems	3,990	-	RFQ		Box	AXEL LITE	RoHS	1GHz	2GB	512MB (NAND), 32MB (NOR)	Active	-	SO-DIMM-204	ARM® Cortex®-A9, i.MX6 Quad	-	MPU Core	-40°C ~ 85°C
101-1067 IC MOD RABBIT 3000 44.2MHZ 1MB Digi	2,143	-	RFQ		Box	RabbitCore®	RoHS	44.2MHz	1MB	512KB (Internal), 8MB (External)	Obsolete	-	2 IDC Headers 2x17, 1 IDC Header 2x5	Rabbit 3000	1.85" x 2.73" (47mm x 69mm)	MPU Core	-40°C ~ 70°C
TE0803-02-04EG-1ID MODULE SOM TE0803-02 Trenz Electronic GmbH	2,744	-	RFQ		Bulk	TE0803	RoHS	-	-	-	Obsolete	-	B2B	-	2.05" x 2.99" (52mm x 76mm)	MPU Core	-
SOMOMAP3530-11-1672IFXR IC MOD CORTEX-A8 600MHZ 128MB Beacon EmbeddedWorks	3,293	-	RFQ	Ficha técnica	Bulk	OMAP35x	RoHS	600MHz	128MB	256MB (NAND), 8MB (NOR)	Obsolete	TMS320C64x (DSP)	Board-to-Board (BTB) Socket - 240	ARM® Cortex®-A8, OMAP3530	1.23" x 3.01" (31.2mm x 76.5mm)	MPU, DSP Core	-20°C ~ 70°C
ME-CA1-30-8C-D7-R6.1 SOM CYCLONE IV EP4CE30 128MB Enclustra FPGA Solutions	2,232	-	RFQ		Box		RoHS	-	128MB	16MB	Active	-	168 Pin	-	2.2" x 2.13" (56mm x 54mm)	FPGA Core	0°C ~ 70°C
101-1068 IC MOD RABBIT 3000 44.2MHZ 1MB Digi	3,282	-	RFQ		Box	RabbitCore®	RoHS	44.2MHz	1MB	512KB (Internal), 4MB (External)	Obsolete	-	2 IDC Headers 2x17, 1 IDC Header 2x5	Rabbit 3000	1.85" x 2.73" (47mm x 69mm)	MPU Core	-40°C ~ 70°C
TE0803-03-4BE21-L MODULE SOM TE0803-03 Trenz Electronic GmbH	3,714	-	RFQ		Bulk		RoHS	-	-	-	Active	-	-	-	-	-	-
SOMOMAP3530-11-1782JFIR IC MOD CORTEX-A8 600MHZ 256MB Beacon EmbeddedWorks	2,724	-	RFQ	Ficha técnica	Bulk	OMAP35x	RoHS	600MHz	256MB	512MB (NAND), 8MB (NOR)	Obsolete	TMS320C64x (DSP)	Board-to-Board (BTB) Socket - 240	ARM® Cortex®-A8, OMAP3530	1.23" x 3.01" (31.2mm x 76.5mm)	MPU, DSP Core	-40°C ~ 85°C
MYC-CZU3EG-4E4D-1200-C ARM & FPGA SOM,XILINX ZYNQ ULTRA MYIR Tech Limited	2,478	-	RFQ	Ficha técnica	Box	MYC-CZU3EG	RoHS	600MHz, 1.5GHz	4GB	4GB	Active	Xilinx Zynq UltraScale+ ZU3EG/4EV/5EV	Header	ARM® Cortex®-A53, ARM® Cortex®-R4	2.36" x 2.05" (60mm x 52mm)	MPU, FPGA Core	0°C ~ 70°C
101-1087 IC MOD RABBIT 3000 44.2MHZ 1MB Digi	2,217	-	RFQ		Box	RabbitCore®	RoHS	44.2MHz	1MB	512KB (Internal), xD-Picture Card (External)	Obsolete	-	2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card	Rabbit 3000	1.85" x 2.73" (47mm x 69mm)	MPU Core	0°C ~ 70°C
TE0803-03-5DE11-A MODULE SOM TE0803-03 Trenz Electronic GmbH	3,650	-	RFQ	Ficha técnica	Bulk	TE0803	RoHS	-	2GB	128MB	Obsolete	-	B2B	Zynq UltraScale+ XCZU5EV-1SFVC784E	2.05" x 2.99" (52mm x 76mm)	MPU Core	0°C ~ 85°C
SOMOMAPL138-10-1502QHCR IC MOD ARM926EJ-S 375MHZ 64MB Beacon EmbeddedWorks	3,599	-	RFQ	Ficha técnica	Bulk	OMAP-L138	RoHS	375MHz	64MB	8MB	Obsolete	TMS320C6748	Board-to-Board (BTB) Socket - 300	ARM926EJ-S, OMAP-L138	1.18" x 1.57" (30mm x 40mm)	MPU, DSP Core	0°C ~ 70°C
DXUD5290I IC MOD CORTEX-A9 1GHZ 2GB 512MB Dave Embedded Systems	3,046	-	RFQ		Box	AXEL ULTRA	RoHS	1GHz	2GB	512MB (NAND), 32MB (NOR)	Active	-	3 x 140 Pins 0.6mm Pitch	ARM® Cortex®-A9, i.MX6 Dual	-	MPU Core	-40°C ~ 85°C
DC-ME-01T-NS-1 IC MODULE ARM7TDMI 55MHZ 8MB Digi	2,433	-	RFQ	Ficha técnica	Box	Digi Connect ME®	RoHS	55MHz	8MB	2MB	Obsolete	-	RJ45	ARM7TDMI, NS7520	1.45" x 0.75" (36.7mm x 19.1mm)	MPU Core	-40°C ~ 85°C
TE0803-02-05EV-1EA IC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH	3,025	-	RFQ		Bulk	TE0803	RoHS	-	2GB	128MB	Obsolete	-	B2B	Zynq UltraScale+ XCZU5EV-1SFVC784E	2.05" x 2.99" (52mm x 76mm)	MPU Core	0°C ~ 85°C
SOMOMAPL138-10-1602AHCR IC MOD ARM926EJ-S 375MHZ 128MB Beacon EmbeddedWorks	3,829	-	RFQ	Ficha técnica	Bulk	OMAP-L138	RoHS	375MHz	128MB	8MB	Obsolete	TMS320C6748	Board-to-Board (BTB) Socket - 300	ARM926EJ-S, OMAP-L138	1.18" x 1.57" (30mm x 40mm)	MPU, DSP Core	0°C ~ 70°C
M100PF-1ACI SOM POLARFIRE FPGA MPF100T ARIES Embedded	2,071	-	RFQ	Ficha técnica	Box		RoHS	-	1GB	4GB	Active	-	Board-to-Board (BTB)	-	2.91" x 1.65" (74mm x 42mm)	FPGA Core	-40°C ~ 85°C