Microcontroladores integrados, módulos FPGA con microprocesador

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series RoHS Speed RAM Size Flash Size Part Status Co-Processor Connector Type Core Processor Size / Dimension Module/Board Type Operating Temperature
DLP-245SY-G

DLP-245SY-G

IC MODULE SX48 50MHZ 262B 4KB

DLP Design Inc.
3,158 -

RFQ

DLP-245SY-G

Ficha técnica

Bulk USB RoHS 50MHz 262B 4KB Obsolete FT245RL USB - B, Pin Header SX48 2.24" x 0.9" (56.9mm x 22.9mm) MCU, USB Core -
TE0820-03-03CG-1ED

TE0820-03-03CG-1ED

IC MODULE ZYNQ USCALE 1GB 128MB

Trenz Electronic GmbH
3,138 -

RFQ

TE0820-03-03CG-1ED

Ficha técnica

Bulk TE0820 RoHS - 1GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU3CG-1SFVC784E 1.57" x 1.97" (40mm x 50mm) MPU Core 0°C ~ 85°C
DLP-FPGA

DLP-FPGA

IC MODULE SPARTAN-3E 70NS 128KB

DLP Design Inc.
2,219 -

RFQ

DLP-FPGA

Ficha técnica

Bulk FPGA RoHS 70ns 128KB - Obsolete FT2232D USB - B, Pin Header Spartan-3E, XC3S250E 2.8" x 1.2" (71.1mm x 30.5mm) FPGA, USB Core -
TE0820-03-02CG-1ED

TE0820-03-02CG-1ED

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH
3,682 -

RFQ

TE0820-03-02CG-1ED

Ficha técnica

Bulk TE0820 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU2CG-1SFVC784E 1.57" x 1.97" (40mm x 50mm) MPU Core 0°C ~ 85°C
DLP-FPGA-M

DLP-FPGA-M

IC MODULE SPARTAN-3E 70NS 128KB

DLP Design Inc.
3,750 -

RFQ

DLP-FPGA-M

Ficha técnica

Bulk FPGA RoHS 70ns 128KB - Obsolete FT2232D USB - B, Pin Header Spartan-3E, XC3S250E 2.8" x 1.2" (71.1mm x 30.5mm) FPGA, USB Core -
TE0820-03-03EG-1ED

TE0820-03-03EG-1ED

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH
3,705 -

RFQ

TE0820-03-03EG-1ED

Ficha técnica

Bulk TE0820 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU3EG-1SFVC784E 1.57" x 1.97" (40mm x 50mm) MPU Core 0°C ~ 80°C
MOD5272-100IR

MOD5272-100IR

IC MOD COLDFIRE 62MHZ 8.004MB

NetBurner Inc.
3,273 -

RFQ

MOD5272-100IR

Ficha técnica

Box RoHS 62MHz 8.004MB 2MB Obsolete - RJ-45, 2x50 Header ColdFire 5272 2.6" x 2" (66.04mm x 50.8mm) MCU, Ethernet Core -40°C ~ 85°C
TE0803-03-2BE11-A

TE0803-03-2BE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH
3,253 -

RFQ

TE0803-03-2BE11-A

Ficha técnica

Bulk TE0803 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU2EG-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
SOMOMAP3503-10-1670HFCR

SOMOMAP3503-10-1670HFCR

IC MOD CORTEX-A8 600MHZ 128MB

Beacon EmbeddedWorks
2,444 -

RFQ

SOMOMAP3503-10-1670HFCR

Ficha técnica

Box OMAP35x RoHS 600MHz 128MB 256MB Obsolete - Board-to-Board (BTB) Socket - 480 ARM® Cortex®-A8, OMAP3503 1.23" x 3.01" (31.2mm x 76.5mm) MPU Core 0°C ~ 70°C
TE0803-03-3AE11-A

TE0803-03-3AE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH
2,462 -

RFQ

TE0803-03-3AE11-A

Ficha técnica

Bulk TE0803 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU2CG-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
SOMOMAP3503-10-1672IFCR

SOMOMAP3503-10-1672IFCR

IC MOD CORTEX-A8 600MHZ 128MB

Beacon EmbeddedWorks
2,979 -

RFQ

SOMOMAP3503-10-1672IFCR

Ficha técnica

Box OMAP35x RoHS 600MHz 128MB 256MB (NAND), 8MB (NOR) Obsolete - Board-to-Board (BTB) Socket - 480 ARM® Cortex®-A8, OMAP3503 1.23" x 3.01" (31.2mm x 76.5mm) MPU Core 0°C ~ 70°C
TE0803-03-2AE11-A

TE0803-03-2AE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH
3,510 -

RFQ

TE0803-03-2AE11-A

Ficha técnica

Bulk TE0803 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU2CG-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
SOMOMAP3530-10-1670EFCR

SOMOMAP3530-10-1670EFCR

IC MOD CORTEX-A8 600MHZ 128MB

Beacon EmbeddedWorks
2,613 -

RFQ

SOMOMAP3530-10-1670EFCR

Ficha técnica

Box OMAP35x RoHS 600MHz 128MB 256MB Obsolete - Board-to-Board (BTB) Socket - 480 ARM® Cortex®-A8, OMAP3503 1.23" x 3.01" (31.2mm x 76.5mm) MPU Core 0°C ~ 70°C
TE0803-03-4DE11-A

TE0803-03-4DE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH
2,532 -

RFQ

TE0803-03-4DE11-A

Ficha técnica

Bulk TE0803 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU4EV-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
SOMOMAP3530-10-1672IFCR

SOMOMAP3530-10-1672IFCR

IC MOD CORTEX-A8 600MHZ 128MB

Beacon EmbeddedWorks
2,822 -

RFQ

SOMOMAP3530-10-1672IFCR

Ficha técnica

Box OMAP35x RoHS 600MHz 128MB 256MB (NAND), 8MB (NOR) Obsolete - Board-to-Board (BTB) Socket - 480 ARM® Cortex®-A8, OMAP3503 1.23" x 3.01" (31.2mm x 76.5mm) MPU Core 0°C ~ 70°C
TE0803-03-4AE11-A

TE0803-03-4AE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH
2,516 -

RFQ

TE0803-03-4AE11-A

Ficha técnica

Bulk TE0803 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU4CG-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
SOMOMAP3530-10-1672IFXR

SOMOMAP3530-10-1672IFXR

IC MOD CORTEX-A8 600MHZ 128MB

Beacon EmbeddedWorks
2,111 -

RFQ

SOMOMAP3530-10-1672IFXR

Ficha técnica

Box OMAP35x RoHS 600MHz 128MB 256MB (NAND), 8MB (NOR) Obsolete - Board-to-Board (BTB) Socket - 480 ARM® Cortex®-A8, OMAP3503 1.23" x 3.01" (31.2mm x 76.5mm) MPU Core -20°C ~ 85°C
TE0803-03-3BE11-A

TE0803-03-3BE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH
3,009 -

RFQ

TE0803-03-3BE11-A

Ficha técnica

Bulk TE0803 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU3EG-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
TE0820-03-02EG-1EL

TE0820-03-02EG-1EL

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH
2,711 -

RFQ

TE0820-03-02EG-1EL

Ficha técnica

Bulk TE0820 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU2EG-1SFVC784E 1.57" x 1.97" (40mm x 50mm) MPU Core 0°C ~ 85°C
TE0820-03-2AI21FA

TE0820-03-2AI21FA

MOD MPSOC

Trenz Electronic GmbH
2,527 -

RFQ

TE0820-03-2AI21FA

Ficha técnica

Bulk TE0820 RoHS - 2GB 128MB Obsolete - Samtec LSHM Zynq UltraScale+ XCZU2CG-1SFVC784I 1.97" x 1.57" (50mm x 40mm) MPU Core -40°C ~ 85°C
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15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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