Microcontroladores integrados, módulos FPGA con microprocesador

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series RoHS Speed RAM Size Flash Size Part Status Co-Processor Connector Type Core Processor Size / Dimension Module/Board Type Operating Temperature
101-0522

101-0522

IC MOD RABBIT 3000 44.2MHZ 768KB

Digi
3,483 -

RFQ

Box RabbitCore® RoHS 44.2MHz 768KB 512KB Obsolete - 2 IDC Headers 2x17 Rabbit 3000 1.85" x 2.73" (47mm x 69mm) MPU Core 0°C ~ 70°C
TE0803-03-4DE21-L

TE0803-03-4DE21-L

MODULE SOM TE0803-03

Trenz Electronic GmbH
2,130 -

RFQ

TE0803-03-4DE21-L

Ficha técnica

Bulk TE0803 RoHS - 4GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU4EV-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
SOMAM3517-10-1780RJXR

SOMAM3517-10-1780RJXR

IC MOD CORTEX-A8 600MHZ 256MB

Beacon EmbeddedWorks
2,202 -

RFQ

SOMAM3517-10-1780RJXR

Ficha técnica

Bulk AM35x RoHS 600MHz 256MB 512MB Obsolete - Board-to-Board (BTB) Socket - 300 ARM® Cortex®-A8, AM3517 1.61" x 2.02" (40.9mm x 51.2mm) MPU Core -20°C ~ 70°C
MX10-U

MX10-U

SOM MAX10 FPGA

ARIES Embedded
2,617 -

RFQ

MX10-U

Ficha técnica

Box RoHS - 128MB 4GB (NAND), 4MB (NOR) Active - 100 Pin - 2.76" x 1.38" (70mm x 35mm) FPGA Core 0°C ~ 70°C
101-0961

101-0961

IC MOD RABBIT 3000 22.1MHZ 256KB

Digi
2,482 -

RFQ

101-0961

Ficha técnica

Box RabbitCore® RoHS 22.1MHz 256KB 512KB (Internal), 1MB (External) Obsolete - IDC Header 2x20 Rabbit 3000 1.2" x 2.95" (30mm x 75mm) MPU Core -40°C ~ 70°C
TE0803-02-04EG-1E3

TE0803-02-04EG-1E3

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH
2,557 -

RFQ

Bulk TE0803 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU4EG-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
SOMC6748-10-1602AHCR

SOMC6748-10-1602AHCR

IC MOD TMS320C6748 300MHZ 128MB

Beacon EmbeddedWorks
3,338 -

RFQ

SOMC6748-10-1602AHCR

Ficha técnica

Bulk RoHS 300MHz 128MB 8MB Obsolete - Board-to-Board (BTB) Socket - 200 TMS320C6748 1.18" x 1.57" (30mm x 40mm) DSP Core 0°C ~ 70°C
MYC-C7Z015-4E1D-766-I

MYC-C7Z015-4E1D-766-I

ARM & FPGA SOM,XILINX ZYNQ 7015,

MYIR Tech Limited
3,018 -

RFQ

MYC-C7Z015-4E1D-766-I

Ficha técnica

Box Zynq®-7000 RoHS 766MHz 1GB 4GB Active Zynq-7000 (Z-7015) Board-to-Board (BTB) Socket ARM® Cortex®-A9 2.95" x 2.17" (75mm x 55mm) MPU, FPGA Core -40°C ~ 85°C
101-1006

101-1006

IC MOD RABBIT 3000 51.6MHZ 1MB

Digi
3,077 -

RFQ

Box RoHS 51.6MHz 1MB 512KB (Internal), 1MB (External) Obsolete - IDC Header 2x25, 2x5, 1x3mm Rabbit 3000 2.35" x 4" (60mm x 102mm) MPU Core -40°C ~ 70°C
TE0803-02-03-1EA-S

TE0803-02-03-1EA-S

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH
2,333 -

RFQ

Bulk TE0803 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU3EG-1SFVC784E 2.05" x 2.99" (52mm x 76mm) FPGA Core 0°C ~ 85°C
SOMOMAP3503-11-1670HFCR

SOMOMAP3503-11-1670HFCR

IC MOD CORTEX-A8 600MHZ 128MB

Beacon EmbeddedWorks
2,434 -

RFQ

SOMOMAP3503-11-1670HFCR

Ficha técnica

Bulk OMAP35x RoHS 600MHz 128MB 256MB Obsolete - Board-to-Board (BTB) Socket - 240 ARM® Cortex®-A8, OMAP3503 1.23" x 3.01" (31.2mm x 76.5mm) MPU Core 0°C ~ 70°C
MCXL-S055BC-I

MCXL-S055BC-I

SOM CYCLONE10LP FPGA

ARIES Embedded
3,170 -

RFQ

MCXL-S055BC-I

Ficha técnica

Box RoHS - 512MB 256MB Active - 221 Pin Header - 3.54" x 1.46" (90mm x 37mm) FPGA Core -
101-1007

101-1007

IC MOD RABBIT 3000 25.8MHZ 256KB

Digi
2,548 -

RFQ

Box RoHS 25.8MHz 256KB 512KB Obsolete - IDC Header 2x25, 2x5, 1x3mm Rabbit 3000 2.35" x 4" (60mm x 102mm) MPU Core -40°C ~ 70°C
TE0803-02-03EG-1EA

TE0803-02-03EG-1EA

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH
3,228 -

RFQ

Bulk TE0803 RoHS - 2GB 128MB Obsolete - B2B Zynq UltraScale+ XCZU3EG-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
SOMOMAP3503-11-1672IFCR

SOMOMAP3503-11-1672IFCR

IC MOD CORTEX-A8 600MHZ 128MB

Beacon EmbeddedWorks
2,498 -

RFQ

SOMOMAP3503-11-1672IFCR

Ficha técnica

Bulk OMAP35x RoHS 600MHz 128MB 256MB (NAND), 8MB (NOR) Obsolete - Board-to-Board (BTB) Socket - 240 ARM® Cortex®-A8, OMAP3503 1.23" x 3.01" (31.2mm x 76.5mm) MPU Core 0°C ~ 70°C
MCXL-H055BBB-I

MCXL-H055BBB-I

SOM CYCLONE10LP FPGA

ARIES Embedded
2,808 -

RFQ

MCXL-H055BBB-I

Ficha técnica

Box RoHS - 1GB 256MB Active - 221 Pin Header - 3.54" x 1.46" (90mm x 37mm) FPGA Core -
101-1051

101-1051

IC MOD RABBIT 3000 44.2MHZ 1MB

Digi
2,543 -

RFQ

Box RabbitCore® RoHS 44.2MHz 1MB 512KB (Internal), 32MB (External) Obsolete - 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card Rabbit 3000 1.85" x 2.73" (47mm x 69mm) MPU Core 0°C ~ 70°C
TE0803-02-03CG-1EA

TE0803-02-03CG-1EA

MODULE SOM TE0803-02

Trenz Electronic GmbH
2,290 -

RFQ

Bulk TE0803 RoHS - - - Obsolete - B2B - 2.05" x 2.99" (52mm x 76mm) MPU Core -
SOMOMAP3503-21-1670AGCR

SOMOMAP3503-21-1670AGCR

IC MOD CORTEX-A8 600MHZ 128MB

Beacon EmbeddedWorks
3,824 -

RFQ

SOMOMAP3503-21-1670AGCR

Ficha técnica

Bulk OMAP35x RoHS 600MHz 128MB 256MB Obsolete - Board-to-Board (BTB) Socket - 200 ARM® Cortex®-A8, OMAP3503 0.59" x 1.06" (15mm x 27mm) MPU Core 0°C ~ 70°C
MA-XU3-2CG-1E-D10-R2

MA-XU3-2CG-1E-D10-R2

SOM ZYNQ US+ ZU2CG 1GB

Enclustra FPGA Solutions
2,249 -

RFQ

Box RoHS 533MHz, 1.333GHz 1GB 16GB Active - SO-DIMM-200 ARM® Quad-/Dual-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU 2.66" x 1.18" (67.6mm x 30mm) MPU, FPGA Core 0°C ~ 85°C
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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