Térmico - Disipadores de calor

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
217-36CTE6

217-36CTE6

HEATSINK DPAK SMT TIN PLATED

Wakefield-Vette
1,174 -

RFQ

217-36CTE6

Ficha técnica

Bulk 217 Active Top Mount SMD Pad Rectangular, Fins 0.740 (18.80mm) 0.600 (15.24mm) - 0.360 (9.14mm) 1.0W @ 55°C 16.00°C/W @ 200 LFM 55.00°C/W Copper
287-1ABE

287-1ABE

HEATSINK FOR TO220

Wakefield-Vette
21,645 -

RFQ

287-1ABE

Ficha técnica

Bulk 287 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.180 (29.97mm) 1.000 (25.40mm) - 0.500 (12.70mm) 4.0W @ 65°C 7.80°C/W @ 200 LFM 16.20°C/W Aluminum
658-35AB

658-35AB

HEATSINK CPU 28MM SQBLK W/O TAPE

Wakefield-Vette
13,289 -

RFQ

658-35AB

Ficha técnica

Tray 658 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100 (27.94mm) 1.100 (27.94mm) - 0.350 (8.89mm) - 3.00°C/W @ 800 LFM - Aluminum
LTN20069

LTN20069

HEAT SINK BGA/PGA 16.5X16.5X8.9

Wakefield-Vette
2,502 -

RFQ

LTN20069

Ficha técnica

Bulk Penguin Active Board Level Thermal Tape, Adhesive (Included) Square, Fins 0.650 (16.51mm) 0.653 (16.59mm) - 0.350 (8.89mm) - 8.00°C/W @ 500 LFM - Aluminum
637-10ABPE

637-10ABPE

HEATSINK TO-220 VERT MT BLK 1

Wakefield-Vette
5,128 -

RFQ

637-10ABPE

Ficha técnica

Box 637 Active Board Level, Vertical Bolt On and Board Mounts Rectangular, Fins 1.000 (25.40mm) 1.375 (34.93mm) - 0.500 (12.70mm) 6.0W @ 76°C 5.80°C/W @ 200 LFM - Aluminum
624-25ABT4E

624-25ABT4E

HEATSINK CPU 21MM SQ W/DBL TAPE

Wakefield-Vette
7,158 -

RFQ

624-25ABT4E

Ficha técnica

Bulk 624 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.250 (6.35mm) - 25.00°C/W @ 200 LFM - Aluminum
647-15ABPE

647-15ABPE

HEATSINK TO-220 W/PINS BLK 1.5

Wakefield-Vette
1,784 -

RFQ

647-15ABPE

Ficha técnica

Bulk 647 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.500 (38.10mm) 1.650 (41.91mm) - 1.000 (25.40mm) 6.0W @ 37°C 3.50°C/W @ 200 LFM - Aluminum
219-263A-TR

219-263A-TR

TO-263 HEAT SINK ANODZD REEL

Wakefield-Vette
2,537 -

RFQ

219-263A-TR

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) 219 Active Top Mount Solderable Feet Rectangular, Fins 0.500 (12.70mm) 1.020 (25.91mm) - 0.480 (12.19mm) 2.0W @ 30°C 8.00°C/W @ 500 LFM - Aluminum
625-25ABT4E

625-25ABT4E

HEATSINK CPU 25MM SQ W/DBL TAPE

Wakefield-Vette
6,016 -

RFQ

625-25ABT4E

Ficha técnica

Bulk 625 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.250 (6.35mm) - 12.00°C/W @ 500 LFM - Aluminum
658-60ABT1E

658-60ABT1E

HEATSINK CPU 28MM SQ BLK W/TAPE

Wakefield-Vette
12,016 -

RFQ

658-60ABT1E

Ficha técnica

Bulk 658 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.100 (27.94mm) 1.100 (27.94mm) - 0.600 (15.24mm) 2.5W @ 30°C 2.00°C/W @ 500 LFM - Aluminum
528-45AB

528-45AB

HEATSINK DC/DC HALF BRICK VERT

Wakefield-Vette
4,122 -

RFQ

528-45AB

Ficha técnica

Bulk 528 Active Board Level Bolt On Rectangular, Fins 2.402 (61.00mm) 2.280 (57.91mm) - 0.450 (11.43mm) 7.0W @ 60°C 3.20°C/W @ 300 LFM - Aluminum
MTN-264-55

MTN-264-55

HEATSINK TO-247/TO-264 W/CLIP

Wakefield-Vette
540 -

RFQ

MTN-264-55

Ficha técnica

Box Mountain Active Top Mount Clip Rectangular, Fins 1.060 (26.92mm) 1.740 (44.20mm) - 1.555 (39.50mm) - - - Aluminum
518-95AB

518-95AB

HEATSINK DC/DC HALF BRICK VERT

Wakefield-Vette
236 -

RFQ

518-95AB

Ficha técnica

Bulk 518 Active Board Level Bolt On Rectangular, Fins 2.402 (61.00mm) 2.280 (57.91mm) - 0.950 (24.13mm) 11.0W @ 60°C 2.00°C/W @ 300 LFM - Aluminum
125349

125349

2.28WX12 EXTRUSION 14228

Wakefield-Vette
1,321 -

RFQ

125349

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 12.000 (304.80mm) 2.280 (57.91mm) - 0.935 (23.75mm) - - 0.07°C/W Aluminum
OMNI-UNI-27-25

OMNI-UNI-27-25

HEATSINK TO-247 TO-264 TO-220

Wakefield-Vette
390 -

RFQ

OMNI-UNI-27-25

Ficha técnica

Bulk OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 0.984 (25.00mm) 1.063 (27.00mm) - 1.969 (50.00mm) - - - Aluminum
OMNI-UNI-32-58

OMNI-UNI-32-58

UNIVERSAL TO HEATSINK 32X58MM

Wakefield-Vette
466 -

RFQ

OMNI-UNI-32-58

Ficha técnica

Tray OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 2.280 (57.90mm) 1.250 (31.75mm) - 1.823 (46.30mm) - - - Aluminum
910-40-2-23-2-B-0

910-40-2-23-2-B-0

HEATSINK 40X40X23MM PIN

Wakefield-Vette
436 -

RFQ

910-40-2-23-2-B-0

Ficha técnica

Box 910 Active Top Mount Push Pin Square, Pin Fins 1.575 (40.00mm) 1.575 (40.00mm) - 0.892 (22.65mm) - 2.00°C/W @ 200 LFM 8.30°C/W Aluminum
260-4T5E

260-4T5E

HEATSINK TO-5 EPOXY INSUL BLK

Wakefield-Vette
1,089 -

RFQ

260-4T5E

Ficha técnica

Bulk 260 Active Board Level Bolt On Cylindrical 0.370 (9.40mm) 0.380 (9.65mm) 0.290 (7.37mm) ID - - - 14.00°C/W -
392-120AB

392-120AB

HI-POWER HEATSINK SSR/IGBT/POWER

Wakefield-Vette
182 -

RFQ

392-120AB

Ficha técnica

Bulk 392 Active Top Mount Press Fit Rectangular, Fins 4.724 (120.00mm) 4.921 (124.99mm) - 5.346 (135.79mm) - 0.20°C/W @ 100 LFM 0.50°C/W Aluminum
122263

122263

HEATSINK 16681 PROFILE 12

Wakefield-Vette
175 -

RFQ

122263

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 12.000 (304.80mm) 8.400 (213.36mm) - 1.400 (35.56mm) - - - Aluminum
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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