Más categorías de productos

Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
59202-G28-12A051LF CONN HDR 24P 0.079 STACK SMD Amphenol ICC (FCI)	800	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	Minitek® 2.00mm	Active	24	0.079 (2.00mm)	2	0.079 (2.00mm)	0.398 (10.100mm)	0.197 (5.000mm)	0.201 (5.100mm)	-	Surface Mount	Solder	Gold	30.0µin (0.76µm)
75970-305-06LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	305	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	1	-	1.025 (26.035mm)	0.460 (11.684mm)	0.445 (11.300mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54121-807041050LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	243	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.825 (20.955mm)	0.292 (7.417mm)	0.413 (10.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54122-108141100LF CONN HDR 14POS 0.100 STACK T/H Amphenol ICC (FCI)	211	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	14	0.100 (2.54mm)	2	0.100 (2.54mm)	0.925 (23.500mm)	0.372 (9.440mm)	0.433 (11.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-805061150LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	2,105	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.695 (17.650mm)	0.122 (3.100mm)	0.453 (11.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
75970-313-02LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	2,406	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	-	-	-	-	Through Hole	Solder	Tin	78.7µin (2.00µm)
54121-809061800LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	3,715	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	1	-	1.025 (26.035mm)	0.196 (4.978mm)	0.709 (18.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54112-406141050LF CONN HDR 14POS 0.100 STACK TH Amphenol ICC (FCI)	2,999	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	14	0.100 (2.54mm)	2	0.100 (2.54mm)	0.744 (18.900mm)	0.236 (6.000mm)	0.413 (10.500mm)	0.095 (2.413mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
76745-121R14LF CONN HDR 14POS 0.100 STACK T/H Amphenol ICC (FCI)	3,159	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	14	0.100 (2.54mm)	2	0.100 (2.54mm)	1.325 (33.660mm)	0.471 (11.963mm)	0.728 (18.500mm)	0.126 (3.200mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-411101950LF CONN HDR 10POS 0.100 STACK TH Amphenol ICC (FCI)	2,607	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.225 (31.115mm)	0.337 (8.560mm)	0.768 (19.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-128081190LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2,576	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.807 (20.500mm)	0.219 (5.550mm)	0.469 (11.900mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-809071800LF CONN HDR 7POS 0.1 STACK T/H Amphenol ICC (FCI)	3,059	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	7	0.100 (2.54mm)	1	-	1.025 (26.035mm)	0.196 (4.978mm)	0.709 (18.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54122-411122500LF CONN HDR 12POS 0.100 STACK TH Amphenol ICC (FCI)	3,569	-	RFQ	Ficha técnica	Bulk,Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	12	0.100 (2.54mm)	2	0.100 (2.54mm)	1.225 (31.115mm)	0.121 (3.073mm)	0.984 (25.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-805100800LF CONN HDR 10POS 0.100 STACK T/H Amphenol ICC (FCI)	2,626	-	RFQ	Ficha técnica	Bulk,Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	0.695 (17.650mm)	0.260 (6.600mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
10124323-401-01LF CONN HDR 1POS STACK T/H TIN Amphenol ICC (FCI)	3,767	-	RFQ	Ficha técnica	Bag	BERGSTIK®	Active	1	-	1	-	0.764 (19.400mm)	0.118 (3.000mm)	0.472 (12.000mm)	0.173 (4.400mm)	Through Hole	Press-Fit, Solder	Tin	78.7µin (2.00µm)
861400011YD1775LF CONN HDR STACK Amphenol ICC (FCI)	3,448	-	RFQ		Bulk	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
77709-332LF CONN HDR STACK Amphenol ICC (FCI)	3,940	-	RFQ		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
77709-331LF CONN HDR STACK Amphenol ICC (FCI)	3,354	-	RFQ		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
75970-393-02LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	2,952	-	RFQ	Ficha técnica	Bulk,Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	0.515 (13.081mm)	0.130 (3.300mm)	0.256 (6.500mm)	0.130 (3.300mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54121-407021300LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	2,696	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	0.825 (20.955mm)	0.193 (4.902mm)	0.512 (13.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)