Soldadura

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type Composition Diameter MeltingPoint FluxType WireGauge MeshType Process Form ShelfLife ShelfLifeStart
732977

732977

97SC HYDRO-X 2% .064DIA 14AWG

Multicore
2,849 -

RFQ

732977

Ficha técnica

Bulk Hydro-X Obsolete Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.064 (1.63mm) 423°F (217°C) Water Soluble 14 AWG, 16 SWG - Lead Free Spool, 1 lb (454 g) - -
SMD291SNL500T3C

SMD291SNL500T3C

SOLDER PASTE NO-CLEAN SAC305 T3

Chip Quik Inc.
2,106 -

RFQ

SMD291SNL500T3C

Ficha técnica

Cartridge - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 3 Lead Free Cartridge, 17.64 oz (500g) 6 Months Date of Manufacture
SMD4300SNL500T3C

SMD4300SNL500T3C

SOLDER PASTE SAC305 T3 500G

Chip Quik Inc.
3,369 -

RFQ

SMD4300SNL500T3C

Ficha técnica

Cartridge - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) Water Soluble - 3 Lead Free Cartridge, 17.64 oz (500g) 6 Months Date of Manufacture
NC191AX500T5C

NC191AX500T5C

SMOOTH FLOW LEADED SOLDER PASTE

Chip Quik Inc.
2,528 -

RFQ

NC191AX500T5C

Ficha técnica

Bulk Smooth Flow™ Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 5 Leaded Cartridge, 17.64 oz (500g) 12 Months Date of Manufacture
SMD291SNL500T4C

SMD291SNL500T4C

SOLDER PASTE SAC305 T4 500G

Chip Quik Inc.
2,532 -

RFQ

SMD291SNL500T4C

Ficha técnica

Cartridge - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Cartridge, 17.64 oz (500g) 6 Months Date of Manufacture
SMD4300SNL500T4C

SMD4300SNL500T4C

SOLDER PASTE SAC305 T4 500G

Chip Quik Inc.
3,077 -

RFQ

SMD4300SNL500T4C

Ficha técnica

Cartridge - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) Water Soluble - 4 Lead Free Cartridge, 17.64 oz (500g) 6 Months Date of Manufacture
MMF006620

MMF006620

361A-20R SOLDER TIN-LEAD-ANTIMON

Micro-Measurements (Division of Vishay Precision Group)
3,789 -

RFQ

MMF006620

Ficha técnica

Bulk - Active Wire Solder Sn63Pb36.65Sb0.35 (63/36.65/0.35) 0.020 (0.51mm) 361°F (183°C) Rosin Activated (RA) 24 AWG, 25 SWG - Leaded Spool, 1 lb (454 g) - -
SMD291AX500T5

SMD291AX500T5

SOLDER PASTE SN63/PB37 500G T5

Chip Quik Inc.
3,712 -

RFQ

SMD291AX500T5

Ficha técnica

Jar - Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 5 Leaded Jar, 17.64 oz (500g) 12 Months Date of Manufacture
SMDAL400C

SMDAL400C

ALUMINUM SOLDER PASTE WATER-SOLU

Chip Quik Inc.
3,196 -

RFQ

SMDAL400C

Ficha técnica

Bulk SMD Active Solder Paste Sn96.5Ag3.5 (96.5/3.5) - 430°F (221°C) Water Soluble - 3 Lead Free Cartridge, 14.11 oz (400g) 12 Months Date of Manufacture
SMD291SNL500T5

SMD291SNL500T5

SOLDER PASTE SAC305 500G T5

Chip Quik Inc.
2,843 -

RFQ

SMD291SNL500T5

Ficha técnica

Jar - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 5 Lead Free Jar, 17.64 oz (500g) 6 Months Date of Manufacture
SMDLTLFP500T4C

SMDLTLFP500T4C

SOLDER PASTE LOW TEMP T4 500G

Chip Quik Inc.
2,626 -

RFQ

SMDLTLFP500T4C

Ficha técnica

Cartridge - Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Cartridge, 17.64 oz (500g) 6 Months Date of Manufacture
MMF006630

MMF006630

1240-FPA SILVER SOLDER PASTE --

Micro-Measurements (Division of Vishay Precision Group)
2,602 -

RFQ

MMF006630

Ficha técnica

Jar - Active Solder Paste Ag40Cu30Zn28Ni2 (40/30/28/2) - 1220 ~ 1435°F (660 ~ 780°C) - - - Lead Free Jar, 1 oz (28g) 9 Months Date of Manufacture
SMD291AX500T5C

SMD291AX500T5C

SOLDER PASTE 63/37 T5 500G

Chip Quik Inc.
3,133 -

RFQ

SMD291AX500T5C

Ficha técnica

Cartridge - Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 5 Leaded Cartridge, 17.64 oz (500g) 12 Months Date of Manufacture
SMD4300AX500T5C

SMD4300AX500T5C

SOLDER PASTE 63/37 T5 500G

Chip Quik Inc.
3,859 -

RFQ

SMD4300AX500T5C

Ficha técnica

Cartridge - Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) Water Soluble - 5 Leaded Cartridge, 17.64 oz (500g) 12 Months Date of Manufacture
70-5426-2411

70-5426-2411

NP505-HR INNOLOT T4 88.2% 600G C

Kester Solder
2,796 -

RFQ

Bulk NP505-HR Active Solder Paste - - - No-Clean - 4 Lead Free Cartridge, 21.16 oz (600g) 6 Months Date of Manufacture
SMDLTLFP500T5C

SMDLTLFP500T5C

SOLDER PASTE LOW TEMP T5 500G

Chip Quik Inc.
3,895 -

RFQ

SMDLTLFP500T5C

Ficha técnica

Cartridge - Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 5 Lead Free Cartridge, 17.64 oz (500g) 6 Months Date of Manufacture
SMD291SNL500T5C

SMD291SNL500T5C

SOLDER PASTE SAC305 T5 500G

Chip Quik Inc.
3,897 -

RFQ

SMD291SNL500T5C

Ficha técnica

Cartridge - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 5 Lead Free Cartridge, 17.64 oz (500g) 6 Months Date of Manufacture
152986

152986

CNP OM5100 063 85-3-M04 S10; ALL

Kester Solder
3,803 -

RFQ

152986

Ficha técnica

Box - Active - - - - - - - - - - -
153712

153712

CNP OM338 771 83.3-3-M04 S10; AL

Kester Solder
3,322 -

RFQ

153712

Ficha técnica

Box - Active - - - - - - - - - - -
9132

9132

SOLDER FINE LINE TUBES 20G 60/40

GC Electronics
3,201 -

RFQ

9132

Ficha técnica

Bulk * Active - - - - - - - - - - -
Total 1666 Record«Prev1... 4243444546474849...84Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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