+86 075582561136
Subir BOM
Soldadura
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SSLFWS-T5-15GSOLDER PASTE WATER SOLUBLE SAC30 SRA Soldering Products |
2,331 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | - | No-Clean, Water Soluble | - | 5 | - | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture |
|
CQ100GEGERMANIUM DOPED SUPER LOW DROSS Chip Quik Inc. |
2,955 | - |
RFQ |
Ficha técnica |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | - | 441°F (227°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - |
|
SSWS-T5-35GSOLDER PASTE WATER SOLUBLE 63/37 SRA Soldering Products |
3,783 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | - | Rosin Mildly Activated (RMA), Water Soluble | - | 5 | - | Syringe, 1.23 oz (35g), 10cc | 24 Months | Date of Manufacture |
|
WBAR62362-1/2LB2SN62/PB36/AG2 1/2 LB. BAR SRA Soldering Products |
2,049 | - |
RFQ |
Ficha técnica |
Bag | SUPER-PURE™ | Active | Bar Solder | Sn62Pb36Ag2 (62/36/2) | - | - | - | - | - | Leaded | Bar, 0.5 lb (266.79g) | - | - |
|
|
117944163/37 381 5C 0.81MM 0.5KG AM Multicore |
2,897 | - |
RFQ |
Ficha técnica |
Bulk | 381™ | Not For New Designs | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 20 AWG, 21 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - |
|
|
421562SN62 C502 5C 1.02MM 0.5KG .040 Multicore |
2,340 | - |
RFQ |
Ficha técnica |
Bulk | C502 | Not For New Designs | Wire Solder | - | 0.040 (1.02mm) | - | No-Clean | 18 AWG, 19 SWG | - | - | Spool, 1 lb (454 g) | - | - |
|
SMDBI100-S-16SOLDER SHOT BI100 16OZ 454G Chip Quik Inc. |
3,006 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Solder Shot | Bi100(100) | - | 521°F (271°C) | - | - | - | Lead Free | Bag, 1 lb (454g) | - | - |
|
4860P-35GLEADED NO CLEAN SOLDER PASTE MG Chemicals |
2,011 | - |
RFQ |
Ficha técnica |
Syringe | 4860 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Syringe, 1.23 oz (35g), 10cc | 24 Months | Date of Manufacture |
|
|
MMF006619361A-20R-25 SOLDER TIN-LEAD-ANTI Micro-Measurements (Division of Vishay Precision Group) |
3,038 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn63Pb36.65Sb0.35 (63/36.65/0.35) | 0.020 (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool | - | - |
|
SSLFWS-T5-35GSOLDER PASTE WATER SOLUBLE SAC30 SRA Soldering Products |
3,157 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | - | No-Clean, Water Soluble | - | 5 | - | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
SSLFWS-T5-50GSOLDER PASTE WATER SOLUBLE SAC30 SRA Soldering Products |
2,671 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | - | No-Clean, Water Soluble | - | 5 | - | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
NC191LTA250SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,882 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 4 | - | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
4896-454GSOLDER RA 60/40 .040 1 LB MG Chemicals |
3,738 | - |
RFQ |
Ficha técnica |
Spool | 4890 | Obsolete | Wire Solder | Sn60Pb40 (60/40) | 0.040 (1.02mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - |
|
4897-454GSOLDER RA 60/40 .050 1 LB MG Chemicals |
3,666 | - |
RFQ |
Ficha técnica |
Spool | 4890 | Obsolete | Wire Solder | Sn60Pb40 (60/40) | 0.050 (1.27mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - |
|
|
WBAR42/57/1SN42/57BI/AG1 1LB BAR SRA Soldering Products |
3,398 | - |
RFQ |
Ficha técnica |
Bag | SUPER-PURE™ | Active | Bar Solder | Bi57Sn42Ag1 (57/42/1) | - | - | - | - | - | Lead Free | Bar, 0.5 lb (266.79g) | - | - |
|
|
WBAR62/36/2SN62/PB36/AG2 1 LB. BAR SRA Soldering Products |
3,344 | - |
RFQ |
Ficha técnica |
Bag | SUPER-PURE™ | Active | Bar Solder | Sn62Pb36Ag2 (62/36/2) | - | - | - | - | - | Leaded | Bar, 1 lb (453.59g) | - | - |
|
SMD2215SOLDER SPHERES 63/37 .030 DIAM Chip Quik Inc. |
2,525 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.030 (0.76mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SSNC-T5-250G63/37 SOLDER PASTE T5 - 250 GRA SRA Soldering Products |
2,592 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
SMD2205SOLDER SPHERES 63/37 .025 DIAM Chip Quik Inc. |
3,385 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.025 (0.64mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMD291AX500T3SOLDER PASTE SN63/PB37 500G Chip Quik Inc. |
3,148 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
