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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
WBWS633731-2OZSOLDER NO-CLEAN 63/37 .031 2 OZ SRA Soldering Products |
2,240 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | - | No-Clean, Water Soluble | - | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
SMD2SW.020 1OZSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
3,273 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020 (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 1 oz (28.35g) | - | - |
|
SMDSW.031 1OZSOLDER WIRE NO-CLEAN 63/37 1OZ. Chip Quik Inc. |
2,208 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 1 oz (28.35g) | - | - |
|
SMDSW.020 1OZSOLDER WIRE NO-CLEAN 63/37 1OZ. Chip Quik Inc. |
3,594 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 1 oz (28.35g) | - | - |
|
NC191LT10SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,605 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.35 oz (10g), 5cc | 6 Months | Date of Manufacture |
|
RASWLF.015 1OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
2,189 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 oz (28.35g) | - | - |
|
SMDSW.020 2OZSOLDER WIRE NO-CLEAN 63/37 2OZ. Chip Quik Inc. |
3,215 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
RASW.020 4OZSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
3,452 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 4 oz (113.40g) | - | - |
|
NC191LT15SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,293 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
|
RASWLF.031 2OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
2,319 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
SMDSWLF.031 1OZSLD WIRE NO-CLEAN 96.5/3/.5 1OZ. Chip Quik Inc. |
2,516 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 oz (28.35g) | - | - |
|
SMDSWLF.015 1OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
2,535 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 1 oz (28.35g) | - | - |
|
SMD2SWLF.031 1OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
2,215 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031 (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 1 oz (28.35g) | - | - |
|
RASWLF.020 2OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3,833 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
SMD2SWLF.020 1OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
3,371 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.020 (0.51mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 1 oz (28.35g) | - | - |
|
SMD2SWLF.015 1OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
3,091 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015 (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 1 oz (28.35g) | - | - |
|
RASWLF.015 2OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
2,175 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
NC191AX15T5SMOOTH FLOW LEADED SOLDER PASTE Chip Quik Inc. |
3,246 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture |
|
NC191SNL50SMOOTH FLOW LEAD-FREE SOLDER PAS Chip Quik Inc. |
3,750 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture |
|
NC191LT15T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,394 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 5 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
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