Soldadura

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type Composition Diameter MeltingPoint FluxType WireGauge MeshType Process Form ShelfLife ShelfLifeStart
WC96L2062PSAC

WC96L2062PSAC

SAC 305 WATER SOLUBLE FLUX 8 OZ.

Canfield Technologies
2,363 -

RFQ

Spool * Active - - - - - - - - - - -
15-7340-0062

15-7340-0062

SOLDER SOLID WIRE .062 4LB SPL

Kester Solder
2,229 -

RFQ

15-7340-0062

Ficha técnica

Bulk Solid Core Wire Active Wire Solder Pb93.5Sn5Ag1.5 (93.5/5/1.5) 0.062 (1.57mm) 565 ~ 574°F (296 ~ 301°C) - 14 AWG, 16 SWG - Leaded Spool, 4 lbs (1.81kg) - -
WC96L2031E

WC96L2031E

SAC 305 NO CLEAN 8 OZ .031 DIA.

Canfield Technologies
2,738 -

RFQ

Spool * Active - - - - - - - - - - -
RC96L2031EAG3

RC96L2031EAG3

SAC 305 ROSIN FLUX 8 OZ. .031 DI

Canfield Technologies
2,601 -

RFQ

Spool * Active - - - - - - - - - - -
386832

386832

60/40 370 3% .064DIA. 14AWG

Multicore
2,529 -

RFQ

386832

Ficha técnica

Bulk 370 Active Wire Solder Sn60Pb40 (60/40) 0.064 (1.63mm) 361 ~ 374°F (183 ~ 190°C) Rosin Activated (RA) 14 AWG, 16 SWG - Leaded Spool, 17.64 oz (500g) - -
397102

397102

63/37 400 2% .048DIA 16AWG

Multicore
2,193 -

RFQ

397102

Ficha técnica

Bulk C400 Active Wire Solder Sn63Pb37 (63/37) 0.048 (1.22mm) 361°F (183°C) No-Clean 16 AWG, 18 SWG - Leaded Spool, 1 lb (454 g) - -
386862

386862

63/37 CRYSL 502 2% .032DIA 20AWG

Multicore
2,458 -

RFQ

386862

Ficha técnica

Bulk C502 Active Wire Solder Sn63Pb37 (63/37) 0.032 (0.81mm) 361°F (183°C) No-Clean 20 AWG, 21 SWG - Leaded Spool, 1 lb (454 g) - -
395465

395465

63/37 CRYSL 502 3% .064DIA 14AWG

Multicore
3,175 -

RFQ

395465

Ficha técnica

Bulk C502 Active Wire Solder Sn63Pb37 (63/37) 0.064 (1.63mm) 361°F (183°C) No-Clean 14 AWG, 16 SWG - Leaded Spool, 1 lb (454 g) - -
CC96L2031E

CC96L2031E

SAC 305 NO CLEAN FLUX 8 OZ .031

Canfield Technologies
3,586 -

RFQ

CC96L2031E

Ficha técnica

Spool - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 424°F (217 ~ 218°C) Rosin Mildly Activated (RMA) - - Lead Free Spool, 1 lb (454 g) - -
386827

386827

60/40 370 3% .032DIA 20AWG

Multicore
3,245 -

RFQ

386827

Ficha técnica

Bulk 370 Active Wire Solder Sn60Pb40 (60/40) 0.032 (0.81mm) 361 ~ 374°F (183 ~ 190°C) Rosin Activated (RA) 20 AWG, 21 SWG - Leaded Spool, 17.64 oz (500g) - -
386824

386824

60/40 370 3% .024DIA 22AWG

Multicore
3,904 -

RFQ

386824

Ficha técnica

Bulk 370 Active Wire Solder Sn60Pb40 (60/40) 0.024 (0.61mm) 361 ~ 374°F (183 ~ 190°C) Rosin Activated (RA) 22 AWG, 23 SWG - Leaded Spool, 17.64 oz (500g) - -
86-7068-0118

86-7068-0118

SOLDER SOLID WIRE .118 2.5KG SP

Kester Solder
2,304 -

RFQ

86-7068-0118

Ficha técnica

Bulk Solid Core Wire Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.118 (3.00mm) 423 ~ 424°F (217 ~ 218°C) - 9 AWG, 11 SWG - Lead Free Spool, 5.51 lbs (2.5kg) - -
673832

673832

97SC 400 2% .064DIA 14AWG

Multicore
2,141 -

RFQ

673832

Ficha técnica

Bulk C400 Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.064 (1.63mm) 423°F (217°C) No-Clean 14 AWG, 16 SWG - Lead Free Spool, 1 lb (454 g) - -
SMD291AX

SMD291AX

SOLDER PASTE NO-CLEAN 63/37 5CC

Chip Quik Inc.
106 -

RFQ

SMD291AX

Ficha técnica

Syringe - Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 3 Leaded Syringe, 0.53 oz (15g), 5cc 12 Months Date of Manufacture
SMD291AX10T5

SMD291AX10T5

SOLDER PASTE NO CLEAN T5 10CC

Chip Quik Inc.
2,716 -

RFQ

SMD291AX10T5

Ficha técnica

Syringe - Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 5 Leaded Syringe, 1.23 oz (35g), 10cc 12 Months Date of Manufacture
SMDLTLFP10T5

SMDLTLFP10T5

SOLDER PASTE LOW TEMP LF T5 10CC

Chip Quik Inc.
2,686 -

RFQ

SMDLTLFP10T5

Ficha técnica

Syringe - Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 5 Lead Free Syringe, 1.23 oz (35g), 10cc 6 Months Date of Manufacture
TS391SNL250

TS391SNL250

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.
3,529 -

RFQ

TS391SNL250

Ficha técnica

Bulk - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 12 Months Date of Manufacture
SMD291AX50T3

SMD291AX50T3

SLDR PASTE NO-CLN SN63/PB37 50G

Chip Quik Inc.
2,094 -

RFQ

SMD291AX50T3

Ficha técnica

Jar - Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 3 Leaded Jar, 1.76 oz (50g) 12 Months Date of Manufacture
SMD291AX10

SMD291AX10

SOLDER PASTE NO-CLEAN 63/37 10CC

Chip Quik Inc.
3,166 -

RFQ

SMD291AX10

Ficha técnica

Syringe - Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 3 Leaded Syringe, 1.23 oz (35g), 10cc 12 Months Date of Manufacture
NC2SW.020 0.3OZ

NC2SW.020 0.3OZ

SOLDER WIRE MINI POCKET PACK 60/

Chip Quik Inc.
2,338 -

RFQ

NC2SW.020 0.3OZ

Ficha técnica

Bulk - Active Wire Solder Sn60Pb40 (60/40) 0.020 (0.51mm) 361 ~ 370°F (183 ~ 188°C) No-Clean 24 AWG, 25 SWG - Leaded Tube, 0.3 oz (8.51g) - -
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1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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