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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
EXB-SN96.5AG3.0CU0.5SOLDER BAR SN96.5/AG3.0/CU0.5 1L Chip Quik Inc. |
3,363 | - |
RFQ |
Ficha técnica |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - |
|
SMD3SWLT.047 8OZSOLDER WIRE SN42/BI58 .047 8OZ Chip Quik Inc. |
3,449 | - |
RFQ |
Ficha técnica |
Bulk | SMD3 | Active | Wire Solder | Bi58Sn42 (58/42) | 0.047 (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
|
24-6337-6422SOLDER WATER SOL 27AWG 63/37 1LB Kester Solder |
220 | - |
RFQ |
Ficha técnica |
Spool | 331 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.015 (0.38mm) | 361°F (183°C) | Water Soluble | 27 AWG, 28 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMDIN100-RINDIUM SOLDER RIBBON (IN100) 0.0 Chip Quik Inc. |
3,056 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Ribbon Solder | In100 (100) | - | 315°F (157°C) | - | - | - | Lead Free | Spool | - | - |
|
SMD2SWLT.047 8OZSOLDER WIRE SN42/BI57.6/AG0.4 .0 Chip Quik Inc. |
3,076 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.047 (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
|
NC191LTA250T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,712 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | - | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
24-6337-9703SOLDER RMA FLUX 27AWG 63/37 1LB Kester Solder |
229 | - |
RFQ |
Ficha técnica |
Spool | 285 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.015 (0.38mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMDLTLFP250T3SOLDER PASTE SN42/BI58 250G Chip Quik Inc. |
3,480 | - |
RFQ |
Ficha técnica |
Jar | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
WBENVIROMADE IN USA ENVIROSAFE BAR SRA Soldering Products |
2,492 | - |
RFQ |
Ficha técnica |
Bag | SUPER-PURE™ | Active | Bar Solder | Sn96.5Cu3.45Sb1Ag0.05 (96.5/3.45/1/0.05) | - | 430°F (221°C) | - | - | - | Lead Free | Bar, 1 lb (453.59g) | - | - |
|
SSLTNC-250GLOW TEMPERATURE LEAD FREE SOLDER SRA Soldering Products |
3,613 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
|
24-6040-9703SOLDER FLUX-CORED/285 .015 1LB Kester Solder |
2,820 | - |
RFQ |
Ficha técnica |
Bulk | 285 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015 (0.38mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
NC3SW.031 1LBSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
3,293 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031 (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
WBRC9645LEAD FREE ROSIN FLUX CORE SILVER SRA Soldering Products |
2,264 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Wire Solder | Sn96Ag4 (96/4) | 0.045 (1.14mm) | 430°F (221°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
WBRC96432LEAD FREE ROSIN FLUX CORE SILVER SRA Soldering Products |
2,169 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Wire Solder | Sn96Ag4 (96/4) | 0.032 (0.81mm) | 430°F (221°C) | Rosin Activated (RA) | 17 AWG, 18 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
WBRC96462LEAD FREE ROSIN FLUX CORE SILVER SRA Soldering Products |
3,280 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Wire Solder | Sn96Ag4 (96/4) | 0.062 (1.57mm) | 430°F (221°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (453.59g) | - | - |
|
WB964MADE IN USA 96.5/3.5 ALY 1LB SOL SRA Soldering Products |
3,785 | - |
RFQ |
Ficha técnica |
Bag | SUPER-PURE™ | Active | Bar Solder | Sn96Ag4 (96/4) | - | 430°F (221°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - |
|
SMDSWLF.031 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
2,705 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
WBNCSAC32LEAD FREE NO-CLEAN FLUX CORE SIL SRA Soldering Products |
4,000 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.032 (0.81mm) | 430°F (221°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
TS991SNL500T4SOLDER PASTE THERMALLY STABLE NC Chip Quik Inc. |
2,871 | - |
RFQ |
Ficha técnica |
Bulk | CHIPQUIK® | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
WS991LT500T4SOLDER PASTE THERMALLY STABLE WS Chip Quik Inc. |
3,514 | - |
RFQ |
Ficha técnica |
Bulk | CHIPQUIK® | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | Water Soluble | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture |
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