+86 075582561136
Subir BOM
Soldadura
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
4902P-25GLEAD FREE LOW TEMPERATURE SOLDER MG Chemicals |
2,535 | - |
RFQ |
Ficha técnica |
Bulk | 4902 | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 281°F (138°C) | No-Clean | - | - | Lead Free | Syringe, 0.88 oz (25g) | 24 Months (Refrigerated), 12 Months (Room Temp) | Date of Manufacture |
|
CQ100GE 35GGERMANIUM DOPED SOLDER PASTE NO- Chip Quik Inc. |
3,952 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Solder Paste | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | - | 441°F (227°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMD2SWLF.020 8OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
2,257 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.020 (0.51mm) | 441°F (227°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
|
NC2SW.015 8OZSOLDER WIRE 60/40 TIN/LEAD (SN60 Chip Quik Inc. |
2,066 | - |
RFQ |
Ficha técnica |
Bulk | CHIPQUIK® | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015 (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | - | - | Leaded | Spool, 8 oz (226.80g) | - | - |
|
SMD2SW.031 1LBSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
2,487 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
NC2SW.031 1LBSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
2,455 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
WS991AX35T4THERMALLY STABLE SOLDER PASTE WS Chip Quik Inc. |
2,900 | - |
RFQ |
Ficha técnica |
Bulk | CHIPQUIK® | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture |
|
SMD291SNL10T5SOLDER PASTE LF T5 10CC Chip Quik Inc. |
2,857 | - |
RFQ |
Ficha técnica |
Syringe | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMD2SW.020 1LBSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
2,234 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020 (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
NC2SW.020 1LBSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
3,727 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020 (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMDSW.031 1LBSOLDER WIRE 63/37 TIN/LEAD NO-CL Chip Quik Inc. |
3,427 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
NCSW.031 1LBSOLDER WIRE 63/37 TIN/LEAD NO-CL Chip Quik Inc. |
3,799 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
NCSW.020 1LBSOLDER WIRE 63/37 TIN/LEAD NO-CL Chip Quik Inc. |
2,435 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMDSW.020 1LBSOLDER WIRE 63/37 TIN/LEAD NO-CL Chip Quik Inc. |
2,788 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
WS991LT35T4THERMALLY STABLE SOLDER PASTE WS Chip Quik Inc. |
3,800 | - |
RFQ |
Ficha técnica |
Bulk | CHIPQUIK® | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | Water Soluble | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture |
|
WBNCC633732NO-CLEAN FLUX CORE SOLDER, 63/37 SRA Soldering Products |
2,320 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
WBRC63/3762SRA ROSIN FLUX CORE SOLDER, 63/3 SRA Soldering Products |
2,137 | - |
RFQ |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.062 (1.57mm) | 361°F (183°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | |
|
TS991SNL35T3THERMALLY STABLE SOLDER PASTE NC Chip Quik Inc. |
2,882 | - |
RFQ |
Ficha técnica |
Bulk | CHIPQUIK® | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 3 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture |
|
TS991SNL35T4THERMALLY STABLE SOLDER PASTE NC Chip Quik Inc. |
3,144 | - |
RFQ |
Ficha técnica |
Bulk | CHIPQUIK® | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture |
|
SMDIN52SN48-RINDIUM SOLDER RIBBON (IN52/SN48) Chip Quik Inc. |
3,751 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Ribbon Solder | In52Sn48 (52/48) | - | 244°F (118°C) | - | - | - | Lead Free | Spool | - | - |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
