Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
808-AG11D-ESL-LF

808-AG11D-ESL-LF

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
3,005 -

RFQ

808-AG11D-ESL-LF

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
818-AG11D-ESL-LF

818-AG11D-ESL-LF

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
3,117 -

RFQ

818-AG11D-ESL-LF

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
822-AG11D-ESL-LF

822-AG11D-ESL-LF

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors
2,572 -

RFQ

822-AG11D-ESL-LF

Ficha técnica

Tube 800 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
5-1571552-6

5-1571552-6

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
3,507 -

RFQ

5-1571552-6

Ficha técnica

Tube,Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
814-AG11D-ESL-LF

814-AG11D-ESL-LF

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
3,818 -

RFQ

814-AG11D-ESL-LF

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
824-AG11D-ESL-LF

824-AG11D-ESL-LF

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
2,568 -

RFQ

824-AG11D-ESL-LF

Ficha técnica

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
828-AG11D-ESL-LF

828-AG11D-ESL-LF

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
3,388 -

RFQ

828-AG11D-ESL-LF

Ficha técnica

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
824-AG31D-ESL-LF

824-AG31D-ESL-LF

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
3,235 -

RFQ

824-AG31D-ESL-LF

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
3-1571586-2

3-1571586-2

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
2,011 -

RFQ

3-1571586-2

Ficha técnica

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
3-1571586-4

3-1571586-4

CONN IC DIP SOCKET 48POS GOLD

TE Connectivity AMP Connectors
2,350 -

RFQ

3-1571586-4

Ficha técnica

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
4-1571552-4

4-1571552-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,717 -

RFQ

4-1571552-4

Ficha técnica

Tube,Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
4-1571552-8

4-1571552-8

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
3,537 -

RFQ

4-1571552-8

Ficha técnica

Tube,Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
249-930X-XX-2401

249-930X-XX-2401

CONN SOCKET BGA 49POS GOLD

3M
2,532 -

RFQ

- Textool™ Obsolete BGA 49 (Verification Required) 0.039 (1.00mm) Gold - - Through Hole Closed Frame - - - - - -
508-AG10D-ES

508-AG10D-ES

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
2,051 -

RFQ

508-AG10D-ES

Ficha técnica

Bulk,Box 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Polyester
840-AG11D-ES

840-AG11D-ES

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
2,660 -

RFQ

840-AG11D-ES

Ficha técnica

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
1-1437540-7

1-1437540-7

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
3,145 -

RFQ

1-1437540-7

Ficha técnica

Tube,Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
828-AG11D

828-AG11D

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
3,746 -

RFQ

828-AG11D

Ficha técnica

Tube,Box 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester
1437540-2

1437540-2

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors
3,293 -

RFQ

1437540-2

Ficha técnica

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
1571541-3

1571541-3

CONN SOCKET PLCC 68POS TIN

TE Connectivity AMP Connectors
3,230 -

RFQ

1571541-3

Ficha técnica

Bulk PCS Obsolete PLCC 68 (4 x 17) 0.100 (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Polyphenylene Sulfide (PPS)
1571552-3

1571552-3

CONN IC DIP SOCKET 14POS TIN

TE Connectivity AMP Connectors
2,270 -

RFQ

1571552-3

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 779780781782783784785786...1100Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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