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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XR2A-2815CONN IC DIP SOCKET 28POS GOLD Omron Electronics Inc-EMC Div |
2,233 | - |
RFQ |
Ficha técnica |
Bulk | XR2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
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XR2C-1511-NCONN SOCKET SIP 15POS GOLD Omron Electronics Inc-EMC Div |
2,389 | - |
RFQ |
Ficha técnica |
Bulk | XR2 | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
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XR2E-3204CONN SOCKET SIP 32POS GOLD Omron Electronics Inc-EMC Div |
3,248 | - |
RFQ |
Ficha técnica |
Bulk | XR2 | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
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XR2H-1611-NCONN ZIG-ZAG 16POS GOLD Omron Electronics Inc-EMC Div |
3,072 | - |
RFQ |
Ficha técnica |
Bulk | XR2 | Active | Zig-Zag | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
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1-345442-3CONN SOCKET PGA 68POS GOLD TE Connectivity AMP Connectors |
3,617 | - |
RFQ |
Ficha técnica |
Bulk | - | Obsolete | PGA | 68 (11 x 11) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Thermoplastic, Polyester, Glass Filled |
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1814640-2CONN IC DIP SOCKET 4POS GOLD TE Connectivity AMP Connectors |
2,867 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Brass | Thermoplastic, Polyester |
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1814640-6CONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors |
3,485 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Thermoplastic, Polyester |
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1814640-7CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
2,823 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Thermoplastic, Polyester |
|
1814640-8CONN IC DIP SOCKET 8POS TIN TE Connectivity AMP Connectors |
3,660 | - |
RFQ |
Ficha técnica |
Bulk,Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester |
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1814640-9CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
3,830 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Thermoplastic, Polyester |
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1-1814640-1CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
2,170 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Brass | Thermoplastic, Polyester |
|
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1-1814640-7CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
3,363 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Brass | Thermoplastic, Polyester |
|
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2-1814640-5CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
2,303 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Thermoplastic, Polyester |
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2-1814640-6CONN IC DIP SOCKET 20POS TIN TE Connectivity AMP Connectors |
3,424 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester |
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1814642-1CONN IC DIP SOCKET 4POS GOLD TE Connectivity AMP Connectors |
2,214 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Thermoplastic, Polyester |
|
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2-1814642-6CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors |
2,795 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester |
|
|
2-1814642-7CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
3,334 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Thermoplastic, Polyester |
|
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1814643-3CONN IC DIP SOCKET 4POS GOLD TE Connectivity AMP Connectors |
2,286 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | Thermoplastic, Polyester |
|
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1814643-8CONN IC DIP SOCKET 10POS GOLD TE Connectivity AMP Connectors |
3,429 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | Thermoplastic, Polyester |
|
|
2-1814643-1CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
2,286 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | Thermoplastic, Polyester |
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