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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
116-43-314-41-006000CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp. |
3,692 | - |
RFQ |
Tube | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
28-6574-10CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics |
3,110 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
242-1289-00-0602JCONN IC DIP SOCKET ZIF 42POS GLD 3M |
2,470 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
256-4205-01CONN SOCKET QFN 56POS GOLD 3M |
2,740 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | QFN | 56 (4 x 14) | 0.016 (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.016 (0.40mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
NTE435P22SOCKET FOR 22 PIN DIP NTE Electronics, Inc |
3,253 | - |
RFQ |
Ficha técnica |
Bag | - | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | - | - | - | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | - |
|
210-1-24-006CONN IC DIP SOCKET 24POS GOLD CNC Tech |
2,289 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
D01-9970942CONN SOCKET SIP 9POS GOLD Harwin Inc. |
667 | - |
RFQ |
Ficha técnica |
Tube | D01-997 | Active | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
|
210-1-32-006CONN IC DIP SOCKET 32POS GOLD CNC Tech |
3,227 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
210-1-48-006CONN IC DIP SOCKET 48POS GOLD CNC Tech |
3,268 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
NTE436W1414-PIN DIP IC SOCKET NTE Electronics, Inc |
2,657 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 14 (2 x 7) | - | - | - | - | Through Hole | - | Wire Wrap | - | - | - | - | - |
|
NTE436W1616-PIN DIP IC SOCKET NTE Electronics, Inc |
3,483 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | - | - | - | - | Through Hole | - | Wire Wrap | - | - | - | - | - |
|
8484-21A1-RK-TPCONN SOCKET PLCC 84POS TIN 3M |
3,441 | - |
RFQ |
Ficha técnica |
Tube | 8400 | Active | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
211-1-48-006CONN IC DIP SOCKET 48POS GOLD CNC Tech |
2,758 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
ICA-324-STTCONN IC DIP SOCKET 24POS TIN Samtec Inc. |
3,469 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
216-3340-00-0602JCONN IC DIP SOCKET ZIF 16POS GLD 3M |
3,068 | - |
RFQ |
Ficha técnica |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
|
AW 127-02/Z-TSOCKET 2 CONTACTS SINGLE ROW Assmann WSW Components |
2,934 | - |
RFQ |
Ficha técnica |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
AW 127-03/Z-TSOCKET 3 CONTACTS SINGLE ROW Assmann WSW Components |
3,465 | - |
RFQ |
Ficha técnica |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
AW 127-05/Z-TSOCKET 5 CONTACTS SINGLE ROW Assmann WSW Components |
2,525 | - |
RFQ |
Ficha técnica |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
AW 127-06/Z-TSOCKET 6 CONTACTS SINGLE ROW Assmann WSW Components |
2,229 | - |
RFQ |
Ficha técnica |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
AW 127-07/Z-TSOCKET 7 CONTACTS SINGLE ROW Assmann WSW Components |
3,569 | - |
RFQ |
Ficha técnica |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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