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Zócalos para circuitos integrados, transistores

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
06-0518-10H CONN SOCKET SIP 6POS GOLD Aries Electronics	2,368	-	RFQ	Ficha técnica	Bulk	518	Active	SIP	6 (1 x 6)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
210-47-316-41-001000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	3,678	-	RFQ	Ficha técnica	Tube	210	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-308-41-105000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	3,899	-	RFQ	Ficha técnica	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-624-41-001000 CONN IC DIP SOCKET 24POS TINLEAD Mill-Max Manufacturing Corp.	509	-	RFQ	Ficha técnica	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
SA326040 CONN IC DIP SOCKET 32POS GOLD On Shore Technology Inc.	3,457	-	RFQ	Ficha técnica	Tube	SA	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled
115-87-314-41-003101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	2,619	-	RFQ	Ficha técnica	Tube	115	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-47-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	3,709	-	RFQ	Ficha técnica	Tube	123	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
A-CCS 020-G-T CONN SOCKET PLCC 20POS GOLD Assmann WSW Components	3,596	-	RFQ	Ficha técnica	Tube	-	Active	PLCC	20 (4 x 5)	0.050 (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)
08-3518-11 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3,531	-	RFQ	Ficha técnica	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
115-43-316-41-003000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	325	-	RFQ	Ficha técnica	Tube	115	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-87-610-41-008101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	3,262	-	RFQ	Ficha técnica	Tube	116	Active	DIP, 0.6 (15.24mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICA-316-STT CONN IC DIP SOCKET 16POS TIN Samtec Inc.	3,650	-	RFQ	Ficha técnica	Tube	ICA	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
XR2A-1611-N CONN IC DIP SOCKET 16POS GOLD Omron Electronics Inc-EMC Div	2,723	-	RFQ	Ficha técnica	Bulk	XR2	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled
24-3518-10 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	114	-	RFQ	Ficha técnica	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
115-93-324-41-003000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	240	-	RFQ	Ficha técnica	Tube	115	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-0518-10T CONN SOCKET SIP 20POS GOLD Aries Electronics	3,966	-	RFQ	Ficha técnica	Bulk	518	Active	SIP	20 (1 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
D2828-42 CONN IC DIP SOCKET 28POS GOLD Harwin Inc.	3,759	-	RFQ	Ficha técnica	Tube	D2	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic
111-93-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	255	-	RFQ	Ficha técnica	Tube	111	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-628-41-003000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	3,826	-	RFQ	Ficha técnica	Tube	115	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ICF-628-T-O-TR CONN IC DIP SOCKET 28POS TIN Samtec Inc.	2,226	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	iCF	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)