Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-93-316-61-001000

115-93-316-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,964 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-43-310-61-001000

116-43-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,749 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-310-61-001000

116-93-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,139 -

RFQ

Tube * Active - - - - - - - - - - - - - -
612-43-648-41-004000

612-43-648-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,790 -

RFQ

612-43-648-41-004000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-648-41-004000

612-93-648-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,985 -

RFQ

612-93-648-41-004000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-652-41-002000

126-41-652-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,555 -

RFQ

126-41-652-41-002000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-652-41-002000

126-91-652-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,819 -

RFQ

126-91-652-41-002000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-964-31-012000

614-93-964-31-012000

SOCKET CARRIER LOWPRO .900 64POS

Mill-Max Manufacturing Corp.
2,432 -

RFQ

614-93-964-31-012000

Ficha técnica

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-964-31-012000

614-43-964-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,701 -

RFQ

614-43-964-31-012000

Ficha técnica

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-636-61-001000

110-44-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,208 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-99-636-61-001000

110-99-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,939 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-952-41-008000

116-93-952-41-008000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
2,536 -

RFQ

116-93-952-41-008000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-952-41-008000

116-43-952-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,469 -

RFQ

116-43-952-41-008000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-642-41-003000

126-93-642-41-003000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.
3,736 -

RFQ

126-93-642-41-003000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-642-41-003000

126-43-642-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,273 -

RFQ

126-43-642-41-003000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-422-61-003000

115-44-422-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,156 -

RFQ

Tube * Active - - - - - - - - - - - - - -
510-91-025-05-000001

510-91-025-05-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,963 -

RFQ

510-91-025-05-000001

Ficha técnica

Bulk 510 Active PGA 25 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-025-05-000002

510-91-025-05-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,345 -

RFQ

510-91-025-05-000002

Ficha técnica

Bulk 510 Active PGA 25 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-025-05-000003

510-91-025-05-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,836 -

RFQ

510-91-025-05-000003

Ficha técnica

Bulk 510 Active PGA 25 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-41-650-41-002000

124-41-650-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,147 -

RFQ

124-41-650-41-002000

Ficha técnica

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 240241242243244245246247...608Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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