Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-93-950-41-003000

612-93-950-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,657 -

RFQ

612-93-950-41-003000

Ficha técnica

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-652-41-001000

612-93-652-41-001000

SOCKET CARRIER SLDRTL .600 52POS

Mill-Max Manufacturing Corp.
3,012 -

RFQ

612-93-652-41-001000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-652-41-001000

612-43-652-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,090 -

RFQ

612-43-652-41-001000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-306-61-001000

116-43-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,032 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-306-61-001000

116-93-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,100 -

RFQ

Tube * Active - - - - - - - - - - - - - -
126-93-652-41-001000

126-93-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
2,406 -

RFQ

126-93-652-41-001000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-652-41-001000

126-43-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,728 -

RFQ

126-43-652-41-001000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-314-61-001000

115-43-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,421 -

RFQ

Tube * Active - - - - - - - - - - - - - -
121-13-650-41-001000

121-13-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
3,924 -

RFQ

121-13-650-41-001000

Ficha técnica

Tube 121 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-950-41-008000

116-93-950-41-008000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
3,727 -

RFQ

116-93-950-41-008000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-012-05-001003

510-13-012-05-001003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,796 -

RFQ

510-13-012-05-001003

Ficha técnica

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-652-41-001000

116-93-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
2,594 -

RFQ

116-93-652-41-001000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-950-41-008000

116-43-950-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,178 -

RFQ

116-43-950-41-008000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-324-61-003000

115-44-324-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,009 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-44-624-61-003000

115-44-624-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,721 -

RFQ

Tube * Active - - - - - - - - - - - - - -
127-41-664-41-002000

127-41-664-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,579 -

RFQ

127-41-664-41-002000

Ficha técnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-664-41-002000

127-91-664-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,729 -

RFQ

127-91-664-41-002000

Ficha técnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-950-41-001000

126-93-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
2,907 -

RFQ

126-93-950-41-001000

Ficha técnica

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-950-41-001000

126-43-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,350 -

RFQ

126-43-950-41-001000

Ficha técnica

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-11-650-41-001000

122-11-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,030 -

RFQ

122-11-650-41-001000

Ficha técnica

Tube 122 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 237238239240241242243244...608Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario