Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-47-952-41-105000

110-47-952-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,885 -

RFQ

110-47-952-41-105000

Ficha técnica

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-11-316-41-001000

123-11-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,082 -

RFQ

123-11-316-41-001000

Ficha técnica

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-328-31-007000

614-41-328-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,546 -

RFQ

614-41-328-31-007000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-428-31-007000

614-41-428-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,454 -

RFQ

614-41-428-31-007000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-628-31-007000

614-41-628-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,634 -

RFQ

614-41-628-31-007000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-328-31-007000

614-91-328-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,806 -

RFQ

614-91-328-31-007000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-428-31-007000

614-91-428-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,128 -

RFQ

614-91-428-31-007000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-628-31-007000

614-91-628-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,220 -

RFQ

614-91-628-31-007000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-664-41-005000

117-41-664-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,718 -

RFQ

117-41-664-41-005000

Ficha técnica

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-764-41-005000

117-41-764-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,931 -

RFQ

117-41-764-41-005000

Ficha técnica

Tube 117 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-91-664-41-005000

117-91-664-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,502 -

RFQ

117-91-664-41-005000

Ficha técnica

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-640-41-006000

116-91-640-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,717 -

RFQ

116-91-640-41-006000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-642-41-001000

614-41-642-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,076 -

RFQ

614-41-642-41-001000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-642-41-001000

614-91-642-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,231 -

RFQ

614-91-642-41-001000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-41-640-41-002000

127-41-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,926 -

RFQ

127-41-640-41-002000

Ficha técnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-640-41-002000

127-91-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,938 -

RFQ

127-91-640-41-002000

Ficha técnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-93-632-41-013000

146-93-632-41-013000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
2,914 -

RFQ

146-93-632-41-013000

Ficha técnica

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-43-632-41-013000

146-43-632-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.
3,752 -

RFQ

146-43-632-41-013000

Ficha técnica

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-328-41-001000

614-41-328-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,021 -

RFQ

614-41-328-41-001000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-428-41-001000

614-41-428-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,850 -

RFQ

614-41-428-41-001000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 165166167168169170171172...608Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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