Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-43-642-41-003000

116-43-642-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,003 -

RFQ

116-43-642-41-003000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-324-41-001000

116-41-324-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,663 -

RFQ

116-41-324-41-001000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-424-41-001000

116-41-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,306 -

RFQ

116-41-424-41-001000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-624-41-001000

116-41-624-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,541 -

RFQ

116-41-624-41-001000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-324-41-001000

116-91-324-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,787 -

RFQ

116-91-324-41-001000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-424-41-001000

116-91-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,311 -

RFQ

116-91-424-41-001000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-624-41-001000

116-91-624-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,195 -

RFQ

116-91-624-41-001000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-636-41-006000

116-41-636-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,040 -

RFQ

116-41-636-41-006000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-636-41-006000

116-91-636-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,614 -

RFQ

116-91-636-41-006000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-640-41-780000

104-11-640-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,722 -

RFQ

104-11-640-41-780000

Ficha técnica

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-328-41-003000

116-93-328-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
3,623 -

RFQ

116-93-328-41-003000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-428-41-003000

116-93-428-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
3,947 -

RFQ

116-93-428-41-003000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-628-41-003000

116-93-628-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,866 -

RFQ

116-93-628-41-003000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-91-764-41-005000

117-91-764-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,492 -

RFQ

117-91-764-41-005000

Ficha técnica

Tube 117 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-640-41-006000

116-41-640-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,528 -

RFQ

116-41-640-41-006000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-620-41-105000

117-43-620-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,731 -

RFQ

117-43-620-41-105000

Ficha técnica

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-324-41-780000

104-13-324-41-780000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
3,473 -

RFQ

104-13-324-41-780000

Ficha técnica

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
104-13-424-41-780000

104-13-424-41-780000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
3,175 -

RFQ

104-13-424-41-780000

Ficha técnica

Tube 104 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
116-43-328-41-003000

116-43-328-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,456 -

RFQ

116-43-328-41-003000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-428-41-003000

116-43-428-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,756 -

RFQ

116-43-428-41-003000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 162163164165166167168169...608Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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