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0Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
114-87-316-41-134161CONN IC DIP SOCKET 16POS GOLD Preci-Dip |
3,378 | - |
RFQ |
Ficha técnica |
Tube | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
D2820-42CONN IC DIP SOCKET 20POS GOLD Harwin Inc. |
2,815 | - |
RFQ |
Ficha técnica |
Tube | D2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
110-44-324-41-001000CONN IC DIP SOCKET 24POS TIN Mill-Max Manufacturing Corp. |
3,939 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
10-0518-10CONN SOCKET SIP 10POS GOLD Aries Electronics |
1,574 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
D2814-42CONN IC DIP SOCKET 14POS GOLD Harwin Inc. |
1,186 | - |
RFQ |
Ficha técnica |
Tube | D2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
08-2513-10CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
158 | - |
RFQ |
Ficha técnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
917-47-210-41-005000CONN SOCKET TRANSIST TO-5 10POS Mill-Max Manufacturing Corp. |
442 | - |
RFQ |
Ficha técnica |
Tube | 917 | Active | Transistor, TO-100 | 10 (Round) | - | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
ICO-314-SGTCONN IC DIP SKT 14POS Samtec Inc. |
3,253 | - |
RFQ |
Ficha técnica |
Tube | ICO | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
AR 28-HZW/TNCONN IC DIP SOCKET 28POS GOLD Assmann WSW Components |
2,448 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
20-0511-10CONN SOCKET SIP 20POS TIN Aries Electronics |
2,482 | - |
RFQ |
Ficha técnica |
Bulk | 511 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
299-43-310-11-001000CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp. |
290 | - |
RFQ |
Ficha técnica |
Tube | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
TCC05DCSN-S1403CONN TRANSIST TO-220/TO-247 5POS Sullins Connector Solutions |
3,473 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Transistor, TO-220 and TO-247 | 5 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
40-6554-11CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics |
3,066 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
214-7390-55-1902CONN SOCKET SOIC 14POS GOLD 3M |
3,941 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SOIC | 14 (2 x 7) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
216-7383-55-1902CONN SOCKET SOIC 16POS GOLD 3M |
3,884 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SOIC | 16 (2 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
280-5205-01CONN SOCKET QFN 80POS GOLD 3M |
2,668 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | QFN | 80 (4 x 20) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
232-1287-00-0602JCONN IC DIP SOCKET ZIF 32POS GLD 3M |
2,451 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
240-1288-00-0602JCONN IC DIP SOCKET ZIF 40POS GLD 3M |
2,222 | - |
RFQ |
Ficha técnica |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
A 24-LC-TRCONN IC DIP SOCKET 24POS TIN Assmann WSW Components |
3,608 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
06-0518-10CONN SOCKET SIP 6POS GOLD Aries Electronics |
3,343 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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