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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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256-PLS16001-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,888 | - |
RFQ |
Ficha técnica |
Bulk | PLS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
256-PRS16001-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,923 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
32-3551-18CONN IC DIP SOCKET ZIF 32POS Aries Electronics |
3,954 | - |
RFQ |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
32-3552-18CONN IC DIP SOCKET ZIF 32POS Aries Electronics |
3,002 | - |
RFQ |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
32-3553-18CONN IC DIP SOCKET ZIF 32POS Aries Electronics |
3,145 | - |
RFQ |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
32-6554-18CONN IC DIP SOCKET ZIF 32POS Aries Electronics |
2,719 | - |
RFQ |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
48-6571-18CONN IC DIP SOCKET ZIF 48POS Aries Electronics |
2,161 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled |
|
|
162-PLS20020-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,646 | - |
RFQ |
Ficha técnica |
Bulk | PLS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
162-PRS20020-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,750 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
164-PRS21013-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,810 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
28-3574-18CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics |
2,686 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
28-6572-18CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics |
3,979 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
28-6573-18CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics |
3,837 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
28-6574-18CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics |
3,247 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
223-PLS18017-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,887 | - |
RFQ |
Ficha técnica |
Bulk | PLS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
223-PLS18039-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,259 | - |
RFQ |
Ficha técnica |
Bulk | PLS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
223-PRS18017-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,634 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
223-PRS18039-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,394 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
225-PLS18003-12ZIF PGA SOCKET 225 PIN 18 X 18 Aries Electronics |
3,068 | - |
RFQ |
- | PLS | Active | PGA, ZIF (ZIP) | 225 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | |
|
|
225-PRS17007-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,156 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
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