Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
145-PRS15058-12

145-PRS15058-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,098 -

RFQ

145-PRS15058-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
145-PRS15062-12

145-PRS15062-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,247 -

RFQ

145-PRS15062-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
145-PLS15024-12

145-PLS15024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,939 -

RFQ

145-PLS15024-12

Ficha técnica

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
145-PRS15024-12

145-PRS15024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,956 -

RFQ

145-PRS15024-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
76-PLS19033-12

76-PLS19033-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,962 -

RFQ

76-PLS19033-12

Ficha técnica

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
76-PRS19033-12

76-PRS19033-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,941 -

RFQ

76-PRS19033-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
24-3551-18

24-3551-18

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics
3,820 -

RFQ

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
163-PLS15064-12

163-PLS15064-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,279 -

RFQ

163-PLS15064-12

Ficha técnica

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
163-PLS15065-12

163-PLS15065-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,933 -

RFQ

163-PLS15065-12

Ficha técnica

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
163-PRS15064-12

163-PRS15064-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,830 -

RFQ

163-PRS15064-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
163-PRS15065-12

163-PRS15065-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,350 -

RFQ

163-PRS15065-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
229-PGM16015-10T

229-PGM16015-10T

CONN SOCKET PGA TIN

Aries Electronics
3,262 -

RFQ

229-PGM16015-10T

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
105-PLS17055-12

105-PLS17055-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,259 -

RFQ

105-PLS17055-12

Ficha técnica

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
105-PRS17054-12

105-PRS17054-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,507 -

RFQ

105-PRS17054-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
196-PRS14001-12

196-PRS14001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,757 -

RFQ

196-PRS14001-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
181-PLS15006-12

181-PLS15006-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,267 -

RFQ

181-PLS15006-12

Ficha técnica

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
181-PLS15033-12

181-PLS15033-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,061 -

RFQ

181-PLS15033-12

Ficha técnica

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
181-PRS15006-12

181-PRS15006-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,506 -

RFQ

181-PRS15006-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
181-PRS15033-12

181-PRS15033-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,345 -

RFQ

181-PRS15033-12

Ficha técnica

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
156-PLS16011-12

156-PLS16011-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,210 -

RFQ

156-PLS16011-12

Ficha técnica

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
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1800+ Fabricantes en todo el mundo
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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