Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
299-87-618-10-002101

299-87-618-10-002101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,837 -

RFQ

299-87-618-10-002101

Ficha técnica

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-097-11-041101

510-83-097-11-041101

CONN SOCKET PGA 97POS GOLD

Preci-Dip
3,806 -

RFQ

510-83-097-11-041101

Ficha técnica

Bulk 510 Active PGA 97 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-144-15-001101

510-87-144-15-001101

CONN SOCKET PGA 144POS GOLD

Preci-Dip
3,516 -

RFQ

510-87-144-15-001101

Ficha técnica

Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-650-41-001101

612-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,163 -

RFQ

612-83-650-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-648-41-105101

117-83-648-41-105101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,107 -

RFQ

117-83-648-41-105101

Ficha técnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-008101

116-83-636-41-008101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,161 -

RFQ

116-83-636-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-642-41-001101

121-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,485 -

RFQ

121-83-642-41-001101

Ficha técnica

Bulk 121 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-964-41-001101

115-83-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
3,941 -

RFQ

Bulk 115 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-145-15-001101

510-87-145-15-001101

CONN SOCKET PGA 145POS GOLD

Preci-Dip
3,251 -

RFQ

510-87-145-15-001101

Ficha técnica

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-145-15-002101

510-87-145-15-002101

CONN SOCKET PGA 145POS GOLD

Preci-Dip
2,432 -

RFQ

510-87-145-15-002101

Ficha técnica

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-640-41-001101

116-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,735 -

RFQ

116-87-640-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-146-15-061101

510-87-146-15-061101

CONN SOCKET PGA 146POS GOLD

Preci-Dip
2,953 -

RFQ

510-87-146-15-061101

Ficha técnica

Bulk 510 Active PGA 146 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-640-41-001101

122-83-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,645 -

RFQ

122-83-640-41-001101

Ficha técnica

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-640-41-001101

123-83-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,367 -

RFQ

123-83-640-41-001101

Ficha técnica

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-652-41-001101

612-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,900 -

RFQ

612-83-652-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-142-15-081101

510-87-142-15-081101

CONN SOCKET PGA 142POS GOLD

Preci-Dip
3,400 -

RFQ

510-87-142-15-081101

Ficha técnica

Bulk 510 Active PGA 142 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-632-41-001101

116-83-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,298 -

RFQ

116-83-632-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-650-31-012101

614-83-650-31-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,892 -

RFQ

614-83-650-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-432-41-002101

124-83-432-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,303 -

RFQ

Bulk 124 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-632-41-002101

124-83-632-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,485 -

RFQ

Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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20,000.000 Unidad estándar de producto
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1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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