Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-056-09-041101

510-83-056-09-041101

CONN SOCKET PGA 56POS GOLD

Preci-Dip
3,844 -

RFQ

510-83-056-09-041101

Ficha técnica

Bulk 510 Active PGA 56 (9 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-011101

116-87-420-41-011101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,408 -

RFQ

116-87-420-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-008101

116-83-422-41-008101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,507 -

RFQ

116-83-422-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-640-41-001101

612-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,313 -

RFQ

612-87-640-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-011101

116-87-322-41-011101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,044 -

RFQ

116-87-322-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-002101

116-87-624-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,280 -

RFQ

116-87-624-41-002101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-007101

116-87-428-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,268 -

RFQ

116-87-428-41-007101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-632-41-105101

110-83-632-41-105101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,501 -

RFQ

110-83-632-41-105101

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-081-12-071101

510-87-081-12-071101

CONN SOCKET PGA 81POS GOLD

Preci-Dip
2,338 -

RFQ

510-87-081-12-071101

Ficha técnica

Bulk 510 Active PGA 81 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-006101

116-83-428-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,814 -

RFQ

116-83-428-41-006101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-003101

116-83-628-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,058 -

RFQ

116-83-628-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-642-41-001101

110-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,846 -

RFQ

110-83-642-41-001101

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-628-41-105101

117-83-628-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,057 -

RFQ

117-83-628-41-105101

Ficha técnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-642-41-001101

614-87-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,747 -

RFQ

614-87-642-41-001101

Ficha técnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-656-41-005101

117-87-656-41-005101

CONN IC DIP SOCKET 56POS GOLD

Preci-Dip
3,162 -

RFQ

117-87-656-41-005101

Ficha técnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-640-41-006101

116-87-640-41-006101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,989 -

RFQ

116-87-640-41-006101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-316-11-001101

299-87-316-11-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,461 -

RFQ

299-87-316-11-001101

Ficha técnica

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-652-41-001101

115-87-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,338 -

RFQ

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-084-13-082101

510-87-084-13-082101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
3,306 -

RFQ

510-87-084-13-082101

Ficha técnica

Bulk 510 Active PGA 84 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-084-12-051101

510-87-084-12-051101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
3,515 -

RFQ

510-87-084-12-051101

Ficha técnica

Bulk 510 Active PGA 84 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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