Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-328-41-003101

116-83-328-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,501 -

RFQ

116-83-328-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-628-41-035101

146-87-628-41-035101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,650 -

RFQ

146-87-628-41-035101

Ficha técnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-628-41-036101

146-87-628-41-036101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,747 -

RFQ

146-87-628-41-036101

Ficha técnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-428-41-035101

146-87-428-41-035101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,786 -

RFQ

146-87-428-41-035101

Ficha técnica

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-428-41-036101

146-87-428-41-036101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,688 -

RFQ

146-87-428-41-036101

Ficha técnica

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-312-10-001101

299-83-312-10-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,082 -

RFQ

299-83-312-10-001101

Ficha técnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-652-41-005101

117-87-652-41-005101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,347 -

RFQ

117-87-652-41-005101

Ficha técnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-424-41-003101

116-83-424-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,486 -

RFQ

116-83-424-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-648-41-003101

115-87-648-41-003101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,391 -

RFQ

115-87-648-41-003101

Ficha técnica

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-076-11-041101

510-87-076-11-041101

CONN SOCKET PGA 76POS GOLD

Preci-Dip
3,498 -

RFQ

510-87-076-11-041101

Ficha técnica

Bulk 510 Active PGA 76 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-084-11-002101

510-87-084-11-002101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
2,315 -

RFQ

510-87-084-11-002101

Ficha técnica

Bulk 510 Active PGA 84 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-084-11-041101

510-87-084-11-041101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
3,082 -

RFQ

510-87-084-11-041101

Ficha técnica

Bulk 510 Active PGA 84 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-084-11-042101

510-87-084-11-042101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
2,465 -

RFQ

510-87-084-11-042101

Ficha técnica

Bulk 510 Active PGA 84 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-084-10-001101

510-87-084-10-001101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
3,080 -

RFQ

510-87-084-10-001101

Ficha técnica

Bulk 510 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-084-10-031101

510-87-084-10-031101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
2,003 -

RFQ

510-87-084-10-031101

Ficha técnica

Bulk 510 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-952-41-001101

110-87-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,775 -

RFQ

110-87-952-41-001101

Ficha técnica

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-009101

116-83-420-41-009101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,867 -

RFQ

116-83-420-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-011101

116-83-318-41-011101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,012 -

RFQ

116-83-318-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-007101

116-87-624-41-007101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,248 -

RFQ

116-87-624-41-007101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-328-41-001101

122-87-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,868 -

RFQ

122-87-328-41-001101

Ficha técnica

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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