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Zócalos para circuitos integrados, transistores

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
550-10-241-18-071101 PGA SOLDER TAIL Preci-Dip	2,285	-	RFQ	Ficha técnica	Bulk	550	Active	PGA	241 (18 x 18)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-360M19-001148 CONN SOCKET BGA 360POS GOLD Preci-Dip	3,325	-	RFQ	Ficha técnica	Bulk	514	Active	BGA	360 (19 x 19)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-255M16-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	2,642	-	RFQ	Ficha técnica	Bulk	558	Active	BGA	255 (16 x 16)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
514-87-352M26-001148 CONN SOCKET BGA 352POS GOLD Preci-Dip	3,789	-	RFQ	Ficha técnica	Bulk	514	Active	BGA	352 (26 x 26)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-238-19-101112 CONN SOCKET PGA 238POS GOLD Preci-Dip	3,018	-	RFQ	Ficha técnica	Bulk	614	Active	PGA	238 (19 x 19)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-391-18-101147 CONN SOCKET PGA 391POS GOLD Preci-Dip	3,724	-	RFQ	Ficha técnica	Bulk	546	Active	PGA	391 (18 x 18)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-299-20-001117 CONN SOCKET PGA 299POS GOLD Preci-Dip	3,566	-	RFQ	Ficha técnica	Bulk	514	Active	PGA	299 (20 x 20)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-256M16-000104 BGA SURFACE MOUNT 1.27MM Preci-Dip	2,658	-	RFQ	Ficha técnica	Bulk	558	Active	BGA	256 (16 x 16)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
558-10-256M20-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	2,594	-	RFQ	Ficha técnica	Bulk	558	Active	BGA	256 (20 x 20)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
518-77-255M16-001105 CONN SOCKET PGA 255POS GOLD Preci-Dip	2,993	-	RFQ	Ficha técnica	Bulk	518	Active	PGA	255 (16 x 16)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
558-10-272M20-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	3,183	-	RFQ	Ficha técnica	Bulk	558	Active	PGA	272 (20 x 20)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
518-77-256M16-000105 CONN SOCKET PGA 256POS GOLD Preci-Dip	2,807	-	RFQ	Ficha técnica	Bulk	518	Active	PGA	256 (16 x 16)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
518-77-256M20-001105 CONN SOCKET PGA 256POS GOLD Preci-Dip	3,364	-	RFQ	Ficha técnica	Bulk	518	Active	PGA	256 (20 x 20)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
514-87-356M26-001148 CONN SOCKET BGA 356POS GOLD Preci-Dip	2,055	-	RFQ	Ficha técnica	Bulk	514	Active	BGA	356 (26 x 26)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-292M20-001152 BGA SOLDER TAIL Preci-Dip	3,688	-	RFQ	Ficha técnica	Bulk	550	Active	BGA	292 (20 x 20)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
518-77-255M16-001106 CONN SOCKET PGA 255POS GOLD Preci-Dip	3,579	-	RFQ	Ficha técnica	Bulk	518	Active	PGA	255 (16 x 16)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
518-77-256M16-000106 CONN SOCKET PGA 256POS GOLD Preci-Dip	2,136	-	RFQ	Ficha técnica	Bulk	518	Active	PGA	256 (16 x 16)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
518-77-256M20-001106 CONN SOCKET PGA 256POS GOLD Preci-Dip	3,942	-	RFQ	Ficha técnica	Bulk	518	Active	PGA	256 (20 x 20)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
517-83-528-21-121111 CONN SOCKET PGA 528POS GOLD Preci-Dip	3,650	-	RFQ	Ficha técnica	Bulk	517	Active	PGA	528 (21 x 21)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-299-20-001112 CONN SOCKET PGA 299POS GOLD Preci-Dip	3,123	-	RFQ	Ficha técnica	Bulk	614	Active	PGA	299 (20 x 20)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled