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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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550-80-296-19-131135PGA SOLDER TAIL Preci-Dip |
2,031 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | PGA | 296 (19 x 19) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-279-19-081117CONN SOCKET PGA 279POS GOLD Preci-Dip |
3,689 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | PGA | 279 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-272M20-001148CONN SOCKET BGA 272POS GOLD Preci-Dip |
2,684 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 272 (20 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-255M16-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,371 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 255 (16 x 16) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
514-83-281-19-081117CONN SOCKET PGA 281POS GOLD Preci-Dip |
3,607 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | PGA | 281 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-256M20-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
3,192 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 256 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-256M16-000101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,137 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 256 (16 x 16) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
550-10-272M20-001152BGA SOLDER TAIL Preci-Dip |
2,242 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 272 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
514-83-292M20-001148CONN SOCKET BGA 292POS GOLD Preci-Dip |
3,628 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 292 (20 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-321-17-101147CONN SOCKET PGA 321POS GOLD Preci-Dip |
2,770 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 321 (17 x 17) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
518-77-272M20-001105CONN SOCKET PGA 272POS GOLD Preci-Dip |
2,252 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 272 (20 x 20) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
614-87-281-19-001112CONN SOCKET PGA 281POS GOLD Preci-Dip |
3,262 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 281 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-279-19-081112CONN SOCKET PGA 279POS GOLD Preci-Dip |
2,508 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 279 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-388M26-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,657 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 388 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
517-83-545-17-000111CONN SOCKET PGA 545POS GOLD Preci-Dip |
2,685 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 545 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-400M20-000166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
2,141 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 400 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
517-83-503-22-131111CONN SOCKET PGA 503POS GOLD Preci-Dip |
2,376 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 503 (22 x 22) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-419-19-001154CONN SOCKET PGA 419POS GOLD Preci-Dip |
3,679 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | PGA | 419 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-304-14-051147CONN SOCKET PGA 304POS GOLD Preci-Dip |
3,190 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 304 (14 x 14) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-87-357M19-001148CONN SOCKET BGA 357POS GOLD Preci-Dip |
2,134 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 357 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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