Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-87-318-41-605101

110-87-318-41-605101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,341 -

RFQ

110-87-318-41-605101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-304-41-004101

116-83-304-41-004101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,880 -

RFQ

116-83-304-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-007101

116-83-306-41-007101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,950 -

RFQ

116-83-306-41-007101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-322-41-001101

110-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,853 -

RFQ

110-87-322-41-001101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-314-10-001101

110-83-314-10-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,418 -

RFQ

110-83-314-10-001101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-322-41-001151

110-87-322-41-001151

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,528 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-018101

116-87-610-41-018101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,386 -

RFQ

116-87-610-41-018101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-032-17-400

540-88-032-17-400

CONN SOCKET PLCC 32POS TIN

Preci-Dip
2,345 -

RFQ

540-88-032-17-400

Ficha técnica

Bulk 540 Active PLCC 32 (4 x 8) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
116-87-308-41-007101

116-87-308-41-007101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,567 -

RFQ

116-87-308-41-007101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-310-31-012101

614-87-310-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,803 -

RFQ

614-87-310-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-610-31-012101

614-87-610-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,312 -

RFQ

614-87-610-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-308-41-006101

116-83-308-41-006101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,152 -

RFQ

116-83-308-41-006101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-316-41-001101

115-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,825 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-210-01-742101

110-83-210-01-742101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,667 -

RFQ

110-83-210-01-742101

Ficha técnica

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5), 6 Loaded 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-312-41-001101

110-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,859 -

RFQ

110-83-312-41-001101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-306-41-035101

146-83-306-41-035101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,294 -

RFQ

146-83-306-41-035101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-306-41-036101

146-83-306-41-036101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,894 -

RFQ

146-83-306-41-036101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-210-41-001101

614-87-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,587 -

RFQ

614-87-210-41-001101

Ficha técnica

Bulk 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-312-41-105101

110-87-312-41-105101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,252 -

RFQ

110-87-312-41-105101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-316-01-931101

110-87-316-01-931101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,498 -

RFQ

110-87-316-01-931101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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