Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
546-87-068-11-061136

546-87-068-11-061136

CONN SOCKET PGA 68POS GOLD

Preci-Dip
2,106 -

RFQ

546-87-068-11-061136

Ficha técnica

Bulk 546 Active PGA 68 (11 x 11) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-132-13-001101

510-83-132-13-001101

CONN SOCKET PGA 132POS GOLD

Preci-Dip
2,817 -

RFQ

510-83-132-13-001101

Ficha técnica

Bulk 510 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-011101

116-83-642-41-011101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,768 -

RFQ

116-83-642-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-009101

116-83-650-41-009101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,388 -

RFQ

116-83-650-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-210-17-061101

510-87-210-17-061101

CONN SOCKET PGA 210POS GOLD

Preci-Dip
3,561 -

RFQ

510-87-210-17-061101

Ficha técnica

Bulk 510 Active PGA 210 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-133-13-001101

510-83-133-13-001101

CONN SOCKET PGA 133POS GOLD

Preci-Dip
3,268 -

RFQ

510-83-133-13-001101

Ficha técnica

Bulk 510 Active PGA 133 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-133-13-002101

510-83-133-13-002101

CONN SOCKET PGA 133POS GOLD

Preci-Dip
3,170 -

RFQ

510-83-133-13-002101

Ficha técnica

Bulk 510 Active PGA 133 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-133-13-043101

510-83-133-13-043101

CONN SOCKET PGA 133POS GOLD

Preci-Dip
2,043 -

RFQ

510-83-133-13-043101

Ficha técnica

Bulk 510 Active PGA 133 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-133-13-041101

510-83-133-13-041101

CONN SOCKET PGA 133POS GOLD

Preci-Dip
2,377 -

RFQ

510-83-133-13-041101

Ficha técnica

Bulk 510 Active PGA 133 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-004101

116-87-636-41-004101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
2,384 -

RFQ

116-87-636-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-668-41-105101

117-83-668-41-105101

CONN IC DIP SOCKET 68POS GOLD

Preci-Dip
3,097 -

RFQ

117-83-668-41-105101

Ficha técnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 68 (2 x 34) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-764-41-105101

117-83-764-41-105101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
2,042 -

RFQ

117-83-764-41-105101

Ficha técnica

Bulk 117 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-064-08-000112

614-87-064-08-000112

CONN SOCKET PGA 64POS GOLD

Preci-Dip
3,172 -

RFQ

614-87-064-08-000112

Ficha técnica

Bulk 614 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-652-41-009101

116-83-652-41-009101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,733 -

RFQ

116-83-652-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-001101

116-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,702 -

RFQ

116-83-648-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-432-41-013101

116-87-432-41-013101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,546 -

RFQ

116-87-432-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-221-18-091101

510-87-221-18-091101

CONN SOCKET PGA 221POS GOLD

Preci-Dip
3,202 -

RFQ

510-87-221-18-091101

Ficha técnica

Bulk 510 Active PGA 221 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-225-18-091101

510-87-225-18-091101

CONN SOCKET PGA 225POS GOLD

Preci-Dip
2,783 -

RFQ

510-87-225-18-091101

Ficha técnica

Bulk 510 Active PGA 225 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-628-41-013101

116-87-628-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,469 -

RFQ

116-87-628-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-624-10-002101

299-83-624-10-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,608 -

RFQ

299-83-624-10-002101

Ficha técnica

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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