Zócalos para circuitos integrados, transistores - Adaptadores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConvertFrom(AdapterEnd) ConvertTo(AdapterEnd) NumberofPins Pitch-Mating ContactFinish-Mating MountingType Termination Pitch-Post ContactFinish-Post HousingMaterial
20-350000-10-HT

20-350000-10-HT

SOCKET ADAPTER SOIC TO 20DIP 0.3

Aries Electronics
3,880 -

RFQ

20-350000-10-HT

Ficha técnica

Bulk Correct-A-Chip® 350000 Active SOIC DIP, 0.3 (7.62mm) Row Spacing 20 0.050 (1.27mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
16-350000-10-HT

16-350000-10-HT

SOCKET ADAPTER SOIC TO 16DIP 0.3

Aries Electronics
2,468 -

RFQ

16-350000-10-HT

Ficha técnica

Bulk Correct-A-Chip® 350000 Active SOIC DIP, 0.3 (7.62mm) Row Spacing 16 0.050 (1.27mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
16-354000-11-RC

16-354000-11-RC

SOCKET ADAPTER DIP TO 16SOIC

Aries Electronics
2,704 -

RFQ

16-354000-11-RC

Ficha técnica

Bulk Correct-A-Chip® 354000 Active DIP, 0.3 (7.62mm) Row Spacing SOIC 16 0.100 (2.54mm) Gold Surface Mount Solder 0.050 (1.27mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled
24-35W000-10

24-35W000-10

SOCKET ADAPT SOIC-W TO 24DIP 0.3

Aries Electronics
2,113 -

RFQ

24-35W000-10

Ficha técnica

Bulk Correct-A-Chip® 35W000 Active SOIC-W DIP, 0.3 (7.62mm) Row Spacing 24 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
800-27-6-1

800-27-6-1

ADAPTER

TE Connectivity Deutsch Connectors
2,455 -

RFQ

Bag * Active - - - - - - - - - -
18-665000-00

18-665000-00

SCK ADAPT 18P SOIC-W TO SOIC 0.6

Aries Electronics
3,936 -

RFQ

18-665000-00

Ficha técnica

Bulk Correct-A-Chip® 665000 Active SOIC-W SOIC 18 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
20-665000-00

20-665000-00

SCK ADAPT 20P SOIC-W TO SOIC 0.6

Aries Electronics
2,313 -

RFQ

20-665000-00

Ficha técnica

Bulk Correct-A-Chip® 665000 Active SOIC-W SOIC 20 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
16-35W000-10

16-35W000-10

SOCKET ADAPT SOIC-W TO 16DIP 0.3

Aries Electronics
3,757 -

RFQ

16-35W000-10

Ficha técnica

Bulk Correct-A-Chip® 35W000 Active SOIC-W DIP, 0.3 (7.62mm) Row Spacing 16 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
22-665000-00

22-665000-00

SCK ADAPT 22P SOIC-W TO SOIC 0.6

Aries Electronics
3,845 -

RFQ

22-665000-00

Ficha técnica

Bulk Correct-A-Chip® 665000 Active SOIC-W SOIC 22 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
1106396-40

1106396-40

SOCKET ADAPTER DIP TO 40DIP 0.6

Aries Electronics
3,956 -

RFQ

1106396-40

Ficha técnica

Bulk Correct-A-Chip® 1106396 Active DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing 40 0.100 (2.54mm) Gold Through Hole Solder 0.100 (2.54mm) Tin Polyamide (PA46), Nylon 4/6, Glass Filled
1107254-40

1107254-40

SOCKET ADAPTER DIP TO 40DIP 0.3

Aries Electronics
2,245 -

RFQ

1107254-40

Ficha técnica

Bulk Correct-A-Chip® 1107254 Active DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing 40 0.100 (2.54mm) Gold Through Hole Solder 0.100 (2.54mm) Tin Polyamide (PA46), Nylon 4/6, Glass Filled
28-665000-00

28-665000-00

SCK ADAPT 28P SOIC-W TO SOIC 0.6

Aries Electronics
3,355 -

RFQ

28-665000-00

Ficha técnica

Bulk Correct-A-Chip® 665000 Active SOIC-W SOIC 28 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
20-350001-11-RC

20-350001-11-RC

SOCKET ADAPTER SOJ TO 20DIP 0.3

Aries Electronics
2,042 -

RFQ

20-350001-11-RC

Ficha técnica

Tube Correct-A-Chip® 350000 Active SOJ DIP, 0.3 (7.62mm) Row Spacing 20 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin -
PA-SOD6SM18-40

PA-SOD6SM18-40

ADAPTER 40SOIC TO 40DIP

Logical Systems Inc.
2,146 -

RFQ

PA-SOD6SM18-40

Ficha técnica

Bulk - Active SOIC DIP, 0.6 (15.24mm) Row Spacing 40 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) - -
PA-TS1D6SM18-40

PA-TS1D6SM18-40

ADAPTER 40TSOP TO 40DIP

Logical Systems Inc.
2,603 -

RFQ

PA-TS1D6SM18-40

Ficha técnica

Bulk - Active TSOP DIP 40 0.020 (0.50mm) - Through Hole Solder 0.100 (2.54mm) - -
20-555000-00

20-555000-00

SOCKET ADAPTER SSOP/SOWIC 20POS

Aries Electronics
2,579 -

RFQ

Bulk Correct-A-Chip® 555000 Active SSOP SOWIC 20 0.026 (0.65mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
10-350000-10-HT

10-350000-10-HT

SOCKET ADAPTER SOIC TO 10DIP 0.3

Aries Electronics
3,084 -

RFQ

10-350000-10-HT

Ficha técnica

Bulk Correct-A-Chip® 350000 Active SOIC DIP, 0.3 (7.62mm) Row Spacing 10 0.050 (1.27mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
12-350000-10-HT

12-350000-10-HT

SOCKET ADAPTER SOIC TO 12DIP 0.3

Aries Electronics
3,682 -

RFQ

12-350000-10-HT

Ficha técnica

Bulk Correct-A-Chip® 350000 Active SOIC DIP, 0.3 (7.62mm) Row Spacing 12 0.050 (1.27mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
20-301550-10

20-301550-10

SOCKET ADAPTER SOIC TO 20PLCC

Aries Electronics
3,160 -

RFQ

20-301550-10

Ficha técnica

Bulk Correct-A-Chip® 301550 Active SOIC PLCC 20 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
20-301550-20

20-301550-20

SOCKET ADAPTER SOIC TO 20PLCC

Aries Electronics
2,753 -

RFQ

20-301550-20

Ficha técnica

Bulk Correct-A-Chip® 301550 Active SOIC PLCC 20 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
Total 274 Record«Prev12345678...14Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario