Zócalos para circuitos integrados, transistores - Adaptadores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConvertFrom(AdapterEnd) ConvertTo(AdapterEnd) NumberofPins Pitch-Mating ContactFinish-Mating MountingType Termination Pitch-Post ContactFinish-Post HousingMaterial
08-350000-10-HT

08-350000-10-HT

SOCKET ADAPTER SOIC TO 8DIP 0.3

Aries Electronics
2,250 -

RFQ

08-350000-10-HT

Ficha técnica

Bulk Correct-A-Chip® 350000 Active SOIC DIP, 0.3 (7.62mm) Row Spacing 8 0.050 (1.27mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
08-666000-00

08-666000-00

SOCKET ADAPTER SOIC TO 8SOWIC

Aries Electronics
3,052 -

RFQ

08-666000-00

Ficha técnica

Bulk Correct-A-Chip® 666000 Active SOIC SOWIC 8 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
14-666000-00

14-666000-00

SOCKET ADAPTER SOIC TO 14SOWIC

Aries Electronics
2,513 -

RFQ

14-666000-00

Ficha técnica

Bulk Correct-A-Chip® 666000 Active SOIC SOWIC 14 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
28-505-111

28-505-111

SOCKET ADAPTER PLCC TO 28PGA

Aries Electronics
3,409 -

RFQ

28-505-111

Ficha técnica

Bulk Correct-A-Chip® 505 Active PLCC PGA 28 0.050 (1.27mm) - Through Hole Solder 0.050 (1.27mm) Tin-Lead -
10-666000-00

10-666000-00

SOCKET ADAPTER SOIC TO 10SOWIC

Aries Electronics
3,506 -

RFQ

10-666000-00

Ficha técnica

Bulk Correct-A-Chip® 666000 Active SOIC SOWIC 10 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
232-1285-29-0602J

232-1285-29-0602J

RECEPTACLE DIP SOCKET 32POS .6

3M
3,303 -

RFQ

232-1285-29-0602J

Ficha técnica

Box Textool™ Active DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing 32 0.100 (2.54mm) Gold Through Hole Solder 0.100 (2.54mm) Gold Polysulfone (PSU), Glass Filled
18-666000-00

18-666000-00

SOCKET ADAPTER SOIC TO 18SOWIC

Aries Electronics
3,995 -

RFQ

18-666000-00

Ficha técnica

Bulk Correct-A-Chip® 666000 Active SOIC SOWIC 18 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
24-650000-10-P

24-650000-10-P

SOCKET ADAPTER SOIC TO 24DIP 0.6

Aries Electronics
2,067 -

RFQ

24-650000-10-P

Ficha técnica

Bulk Correct-A-Chip® 650000 Active SOIC DIP, 0.6 (15.24mm) Row Spacing 24 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
24-350000-10-HT

24-350000-10-HT

SOCKET ADAPTER SOIC TO 24DIP 0.3

Aries Electronics
2,350 -

RFQ

24-350000-10-HT

Ficha técnica

Bulk Correct-A-Chip® 350000 Active SOIC DIP, 0.3 (7.62mm) Row Spacing 24 0.050 (1.27mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
20-666000-00

20-666000-00

SOCKET ADAPTER SOIC TO 20SOWIC

Aries Electronics
3,549 -

RFQ

20-666000-00

Ficha técnica

Bulk Correct-A-Chip® 666000 Active SOIC SOWIC 20 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
44-505-111

44-505-111

SOCKET ADAPTER PLCC TO 44PGA

Aries Electronics
2,696 -

RFQ

44-505-111

Ficha técnica

Bulk Correct-A-Chip® 505 Active PLCC PGA 44 0.050 (1.27mm) - Through Hole Solder 0.050 (1.27mm) Tin-Lead -
14-350000-10-HT

14-350000-10-HT

SOCKET ADAPTER SOIC TO 14DIP 0.3

Aries Electronics
2,833 -

RFQ

14-350000-10-HT

Ficha técnica

Bulk Correct-A-Chip® 350000 Active SOIC DIP, 0.3 (7.62mm) Row Spacing 14 0.050 (1.27mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
08-301296-10

08-301296-10

SOCKET ADAPTER SOIC TO TO-8

Aries Electronics
2,078 -

RFQ

08-301296-10

Ficha técnica

Bulk Correct-A-Chip® 301296 Active SOIC JEDEC 8 0.050 (1.27mm) - Through Hole Solder - Tin-Lead -
08-305479-10

08-305479-10

SOCKET ADAPTER SOIC TO TO-8

Aries Electronics
3,888 -

RFQ

08-305479-10

Ficha técnica

Bulk Correct-A-Chip® 305479 Active SOIC JEDEC 8 0.050 (1.27mm) - Through Hole Solder - Tin-Lead -
22-666000-00

22-666000-00

SOCKET ADAPTER SOIC TO 22SOWIC

Aries Electronics
3,209 -

RFQ

22-666000-00

Ficha técnica

Bulk Correct-A-Chip® 666000 Active SOIC SOWIC 22 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
1106396-36

1106396-36

SOCKET ADAPTER DIP TO 36DIP 0.6

Aries Electronics
2,380 -

RFQ

1106396-36

Ficha técnica

Bulk Correct-A-Chip® 1106396 Active DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing 36 0.100 (2.54mm) Gold Through Hole Solder 0.100 (2.54mm) Tin Polyamide (PA46), Nylon 4/6, Glass Filled
1107254-36

1107254-36

SOCKET ADAPTER DIP TO 36DIP 0.3

Aries Electronics
2,275 -

RFQ

1107254-36

Ficha técnica

Bulk Correct-A-Chip® 1107254 Active DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing 36 0.100 (2.54mm) Gold Through Hole Solder 0.100 (2.54mm) Tin Polyamide (PA46), Nylon 4/6, Glass Filled
18-35W000-10

18-35W000-10

SOCKET ADAPT SOIC-W TO 18DIP 0.3

Aries Electronics
2,232 -

RFQ

18-35W000-10

Ficha técnica

Bulk Correct-A-Chip® 35W000 Active SOIC-W DIP, 0.3 (7.62mm) Row Spacing 18 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
24-666000-00

24-666000-00

SOCKET ADAPTER SOIC TO 24SOWIC

Aries Electronics
2,334 -

RFQ

24-666000-00

Ficha técnica

Bulk Correct-A-Chip® 666000 Active SOIC SOWIC 24 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
20-35W000-10

20-35W000-10

SOCKET ADAPT SOIC-W TO 20DIP 0.3

Aries Electronics
2,976 -

RFQ

20-35W000-10

Ficha técnica

Bulk Correct-A-Chip® 35W000 Active SOIC-W DIP, 0.3 (7.62mm) Row Spacing 20 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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