Zócalos para circuitos integrados, transistores - Adaptadores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConvertFrom(AdapterEnd) ConvertTo(AdapterEnd) NumberofPins Pitch-Mating ContactFinish-Mating MountingType Termination Pitch-Post ContactFinish-Post HousingMaterial
18-350000-10-HT

18-350000-10-HT

SOCKET ADAPTER SOIC TO 18DIP 0.3

Aries Electronics
3,489 -

RFQ

18-350000-10-HT

Ficha técnica

Bulk Correct-A-Chip® 350000 Active SOIC DIP, 0.3 (7.62mm) Row Spacing 18 0.050 (1.27mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
18-354000-10

18-354000-10

SOCKET ADAPTER DIP TO 18SOIC

Aries Electronics
2,280 -

RFQ

18-354000-10

Ficha técnica

Bulk Correct-A-Chip® 354000 Active DIP, 0.3 (7.62mm) Row Spacing SOIC 18 0.100 (2.54mm) Gold Surface Mount Solder 0.050 (1.27mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled
32-354000-10

32-354000-10

SOCKET ADAPTER DIP TO 32SOIC

Aries Electronics
2,931 -

RFQ

32-354000-10

Ficha técnica

Bulk Correct-A-Chip® 354000 Active DIP, 0.3 (7.62mm) Row Spacing SOIC 32 - Gold Surface Mount Solder 0.100 (2.54mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled
20-352000-10

20-352000-10

SOCKET ADAPTER PLCC TO 20DIP 0.3

Aries Electronics
3,816 -

RFQ

20-352000-10

Ficha técnica

Bulk Correct-A-Chip® 352000 Active PLCC DIP, 0.3 (7.62mm) Row Spacing 20 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
20-353000-10

20-353000-10

SOCKET ADAPTER PLCC TO 20DIP 0.3

Aries Electronics
2,289 -

RFQ

20-353000-10

Ficha técnica

Bulk Correct-A-Chip® 353000 Active PLCC DIP, 0.3 (7.62mm) Row Spacing 20 0.050 (1.27mm) Tin-Lead Through Hole Solder 0.100 (2.54mm) Tin-Lead -
28-352000-10

28-352000-10

SOCKET ADAPTER PLCC TO 28DIP 0.3

Aries Electronics
3,997 -

RFQ

28-352000-10

Ficha técnica

Bulk Correct-A-Chip® 352000 Active PLCC DIP, 0.3 (7.62mm) Row Spacing 28 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
28-353000-10

28-353000-10

SOCKET ADAPTER PLCC TO 28DIP 0.3

Aries Electronics
3,116 -

RFQ

28-353000-10

Ficha técnica

Bulk Correct-A-Chip® 353000 Active PLCC DIP, 0.3 (7.62mm) Row Spacing 28 0.050 (1.27mm) Tin-Lead Through Hole Solder 0.100 (2.54mm) Tin-Lead -
95-132I25-P

95-132I25-P

SOCKET ADAPTER QFP TO 132PGA

Aries Electronics
3,590 -

RFQ

95-132I25-P

Ficha técnica

Bulk Correct-A-Chip® 95-132I25 Active QFP PGA 132 0.025 (0.64mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
1111163

1111163

SOCKET ADAPTER SOCKET TO 40PLCC

Aries Electronics
2,601 -

RFQ

1111163

Ficha técnica

Bulk Correct-A-Chip® 1111163 Active Socket, 0.6 (15.24mm) Row Spacing PLCC 40 - Gold - - - - Polyamide (PA46), Nylon 4/6, Glass Filled
68-505-110-RC-P

68-505-110-RC-P

SOCKET ADAPTER PLCC TO 68PGA

Aries Electronics
2,233 -

RFQ

68-505-110-RC-P

Ficha técnica

Bulk Correct-A-Chip® 505 Active PLCC PGA 68 0.050 (1.27mm) - Through Hole Solder 0.050 (1.27mm) Tin-Lead -
68-505-110-RC

68-505-110-RC

SOCKET ADAPTER PLCC TO 68PGA

Aries Electronics
3,366 -

RFQ

68-505-110-RC

Ficha técnica

Bulk Correct-A-Chip® 505 Active PLCC PGA 68 0.050 (1.27mm) - Through Hole Solder 0.050 (1.27mm) Tin-Lead -
32-655000-10-P

32-655000-10-P

SOCKET ADAPTER TSOP TO 32DIP 0.6

Aries Electronics
2,129 -

RFQ

32-655000-10-P

Ficha técnica

Bulk Correct-A-Chip® 655000 Active TSOP DIP, 0.6 (15.24mm) Row Spacing 32 0.020 (0.50mm) Silver Through Hole Solder 0.100 (2.54mm) Tin-Lead -
48-655000-10

48-655000-10

SOCKET ADAPTER TSOP TO 48DIP 0.6

Aries Electronics
2,548 -

RFQ

48-655000-10

Ficha técnica

Bulk Correct-A-Chip® 655000 Obsolete TSOP DIP, 0.6 (15.24mm) Row Spacing 48 0.020 (0.50mm) Silver Through Hole Solder 0.100 (2.54mm) Tin-Lead -
10-665000-00

10-665000-00

SCK ADAPT 10P SOIC-W TO SOIC 0.6

Aries Electronics
2,352 -

RFQ

10-665000-00

Ficha técnica

Bulk Correct-A-Chip® 665000 Active SOIC-W SOIC 10 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
12-665000-00

12-665000-00

SCK ADAPT 12P SOIC-W TO SOIC 0.6

Aries Electronics
2,116 -

RFQ

12-665000-00

Ficha técnica

Bulk Correct-A-Chip® 665000 Active SOIC-W SOIC 12 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
26-665000-00

26-665000-00

SCK ADAPT 26P SOIC-W TO SOIC 0.6

Aries Electronics
3,522 -

RFQ

26-665000-00

Ficha técnica

Bulk Correct-A-Chip® 665000 Active SOIC-W SOIC 26 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
1109252

1109252

SOCKET ADAPTER PLCC TO 28DIP 0.6

Aries Electronics
3,265 -

RFQ

1109252

Ficha técnica

Bulk Correct-A-Chip® 1109252 Active PLCC DIP, 0.6 (15.24mm) Row Spacing 28 - - Through Hole Solder 0.070 (1.78mm) Tin-Lead -
1111903

1111903

SOCKET ADAPT SOWIC TO 24DIP 0.4

Aries Electronics
3,757 -

RFQ

1111903

Ficha técnica

Bulk Correct-A-Chip® 1111903 Active SOWIC DIP, 0.4 (10.16mm) Row Spacing 24 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
14-354W00-20

14-354W00-20

DIP-TO-SOWIC ADAPTER

Aries Electronics
2,991 -

RFQ

14-354W00-20

Ficha técnica

Bulk Correct-A-Chip® 354W00 Active DIP, 0.3 (7.62mm) Row Spacing SOWIC 14 0.100 (2.54mm) Gold Through Hole Solder 0.050 (1.27mm) Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled
16-354W00-20

16-354W00-20

DIP-TO-SOWIC ADAPTER

Aries Electronics
3,684 -

RFQ

16-354W00-20

Ficha técnica

Bulk Correct-A-Chip® 354W00 Active DIP, 0.3 (7.62mm) Row Spacing SOWIC 16 0.100 (2.54mm) Gold Through Hole Solder 0.050 (1.27mm) Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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