Zócalos para circuitos integrados, transistores - Adaptadores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConvertFrom(AdapterEnd) ConvertTo(AdapterEnd) NumberofPins Pitch-Mating ContactFinish-Mating MountingType Termination Pitch-Post ContactFinish-Post HousingMaterial
96-128M80

96-128M80

QFP TO PGA 128 PIN

Aries Electronics
3,692 -

RFQ

- Correct-A-Chip® Obsolete QFP PGA 128 0.031 (0.80mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
96-208M50

96-208M50

SOCKET ADAPTER QFP TO 208PGA

Aries Electronics
2,453 -

RFQ

96-208M50

Ficha técnica

Bulk Correct-A-Chip® 96-208M50 Active QFP PGA 208 0.020 (0.50mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
97-68340

97-68340

SOCKET ADAPTER QFP TO 144PGA

Aries Electronics
3,188 -

RFQ

97-68340

Ficha técnica

Bulk Correct-A-Chip® 97-68340 Active QFP PGA 144 0.026 (0.65mm) Tin Through Hole Solder 0.100 (2.54mm) Tin -
95-100I25

95-100I25

SOCKET ADAPTER QFP TO 100PGA

Aries Electronics
2,581 -

RFQ

95-100I25

Ficha técnica

- - Obsolete QFP PGA 100 0.025 (0.64mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
96-080M80

96-080M80

SOCKET ADAPTER QFP TO 80PGA

Aries Electronics
3,342 -

RFQ

96-080M80

Ficha técnica

- - Obsolete QFP PGA 80 0.031 (0.80mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
52-505-110

52-505-110

SOCKET ADAPTER PLCC TO 52PGA

Aries Electronics
2,965 -

RFQ

52-505-110

Ficha técnica

Bulk Correct-A-Chip® 505 Obsolete PLCC PGA 52 0.050 (1.27mm) - Through Hole Solder 0.050 (1.27mm) Tin-Lead -
DS9075-40V/NO-BRAND

DS9075-40V/NO-BRAND

SOCKET ADAPTER SIP TO 40DIP

Analog Devices Inc./Maxim Integrated
2,801 -

RFQ

DS9075-40V/NO-BRAND

Ficha técnica

Bulk DS9075 Obsolete SIP DIP 40 - - - - - - -
97-68340-P

97-68340-P

ADAPTER/PANEL QFP TO PGA 144POS

Aries Electronics
3,110 -

RFQ

97-68340-P

Ficha técnica

Bulk Correct-A-Chip® 68340 Active QFP PGA 144 0.026 (0.65mm) Tin Through Hole Solder 0.100 (2.54mm) Tin -
44-305263-20

44-305263-20

SOCKET ADAPTER QFP TO 44PLCC

Aries Electronics
3,145 -

RFQ

44-305263-20

Ficha técnica

Bulk Correct-A-Chip® 305263 Active QFP PLCC 44 0.024 (0.60mm) - Through Hole Solder 0.050 (1.27mm) Tin-Lead -
14-354W00-10

14-354W00-10

CONN ADAPTER 14PIN DIP TO SOWIC

Aries Electronics
2,396 -

RFQ

14-354W00-10

Ficha técnica

Tube Correct-A-Chip® 354W00 Active DIP, 0.3 (7.62mm) Row Spacing SOWIC 14 0.100 (2.54mm) Gold Through Hole Solder 0.050 (1.27mm) Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled
16-354W00-10

16-354W00-10

CONN ADAPTER 16PIN DIP TO SOWIC

Aries Electronics
2,545 -

RFQ

16-354W00-10

Ficha técnica

Tube Correct-A-Chip® 354W00 Active DIP, 0.3 (7.62mm) Row Spacing SOWIC 16 0.100 (2.54mm) Gold Through Hole Solder 0.050 (1.27mm) Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled
20-354W00-10

20-354W00-10

CONN ADAPTER 20PIN DIP TO SOWIC

Aries Electronics
3,539 -

RFQ

20-354W00-10

Ficha técnica

Tube Correct-A-Chip® 354W00 Active DIP, 0.3 (7.62mm) Row Spacing SOWIC 20 0.100 (2.54mm) Gold Through Hole Solder 0.050 (1.27mm) Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled
24-354W00-10

24-354W00-10

CONN ADAPTER 24PIN DIP TO SOWIC

Aries Electronics
2,057 -

RFQ

24-354W00-10

Ficha técnica

Tube Correct-A-Chip® 354W00 Active DIP, 0.3 (7.62mm) Row Spacing SOWIC 24 0.100 (2.54mm) Gold Through Hole Solder 0.050 (1.27mm) Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled
16-304235-10

16-304235-10

16-PIN SOCKET TO PIN ADAPTER

Aries Electronics
3,671 -

RFQ

Bulk Correct-A-Chip® 304235 Active DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing 16 - Gold Through Hole Solder - Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled
16-304633-18

16-304633-18

SOCKET ADAPTER 20PLCC TO 16DIP

Aries Electronics
2,182 -

RFQ

Bulk Correct-A-Chip® 304633 Active PLCC DIP, 0.3 (7.62mm) Row Spacing 16 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
28-651000-11-RC

28-651000-11-RC

SOCKET ADAPTER SSOP TO 28DIP 0.6

Aries Electronics
3,896 -

RFQ

Tube Correct-A-Chip® 651000 Obsolete SSOP DIP, 0.6 (15.24mm) Row Spacing 28 0.026 (0.65mm) - Through Hole Solder 0.100 (2.54mm) Gold -
224-5248-09-0602J

224-5248-09-0602J

RECEPTACLE DIP SOCKET 24POS .3

3M
2,933 -

RFQ

224-5248-09-0602J

Ficha técnica

Box Textool™ Obsolete DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing 24 0.100 (2.54mm) Gold Through Hole Solder 0.100 (2.54mm) Gold Polysulfone (PSU), Glass Filled
224-5248-19-0602J

224-5248-19-0602J

RECEPTACLE DIP SOCKET 24POS .3

3M
2,980 -

RFQ

224-5248-19-0602J

Ficha técnica

Box Textool™ Active DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing 24 0.100 (2.54mm) Gold Through Hole Solder 0.100 (2.54mm) Gold Polysulfone (PSU), Glass Filled
228-1277-29-0602J

228-1277-29-0602J

RECEPTACLE DIP SOCKET 28POS .6

3M
2,100 -

RFQ

228-1277-29-0602J

Ficha técnica

Box Textool™ Obsolete DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing 28 0.100 (2.54mm) Gold Through Hole Solder 0.100 (2.54mm) Gold Polysulfone (PSU), Glass Filled
228-1290-29-0602J

228-1290-29-0602J

RECEPTACLE DIP SOCKET 28POS .4

3M
3,561 -

RFQ

228-1290-29-0602J

Ficha técnica

Box Textool™ Active DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing 28 0.070 (1.78mm) Gold Through Hole Solder 0.070 (1.78mm) Gold Polysulfone (PSU), Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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